ATI Radeon HD 3850 X2 vs ATI Radeon HD 5550 Full Specs
640 Shaders 668MHz | 320 Shaders 550MHz |
1048MB GDDR3106GB/s | 524MB GDDR325.6GB/s |
·· 855 GFLOPS | ·· 352 GFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 140W | TDP 39W |
Power Connectors 1x 8-Pin 1x 6-Pin | Power Connectors - |
Clock Speed ·· | Clock Speed ·· |
Peak OPS 855 GFLOPSFP32 | Peak OPS 352 GFLOPSFP32 |
FP32 855 GFLOPS | FP32 352 GFLOPS |
FP64 171 GFLOPS | - |
Pixel Rate 10.7 GPixel/s | Pixel Rate 4.4 GPixel/s |
Texture Rate 10.7 GTexel/s | Texture Rate 8.8 GTexel/s |
Shaders 640 Shaders | Shaders 320 Shaders |
TMUs 32 TMUs | TMUs 16 TMUs |
ROPs 32 ROPs | ROPs 8 ROPs |
CUs 8 CUs | CUs 4 CUs |
Boost Clock 668MHz | Boost Clock 550MHz |
L2 Cache 256KB shared | L2 Cache 256KB shared |
1048MB GDDR3 | 524MB GDDR3 |
Memory Bus 256-bit | Memory Bus 128-bit |
Memory Speed 1.7GT/s | Memory Speed 1.6GT/s |
Memory Bandwidth 106GB/s | Memory Bandwidth 25.6GB/s |
TDP 140W | TDP 39W |
Multi-Monitor 2 | Multi-Monitor 2 |
- | 1x HDMI 1.3 |
2x DVI-I Dual-Link | 1x DVI-I Dual-Link |
- | 1x VGA |
1x S-Video | - |
Decoder Model UVD 1.0 | Decoder Model UVD 2.2 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 1-Slots |
Cooling Open-Air 1x Fan | Cooling Open-Air 1x Fan |
Power Connectors 1x 8-Pin, 1x 6-Pin | Power Connectors - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Boom | Codename Redwood |
Chip Variant RV670 Pro | Chip Variant Redwood LE |
Market Segment Desktop | Market Segment Desktop |
Release Date Apr 4, 2008 | Release Date Feb 9, 2010 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 55nm | Fabrication Node 40nm |
Die Size 192mm² | Die Size 104mm² |
Transistor Count 666 Million | Transistor Count 627 Million |
Transistor Density 3.47 MTr/mm² | Transistor Density 6.03 MTr/mm² |
No images available
No images available



