GPUs

AMD Edmonton vs Apple 4-Core A19 Full Specs

768 Shaders
914MHz
512 Shaders
1.47GHz
Shared Memory
Shared Memory68.3GB/sLPDDR5X
··
1.4 TFLOPS
··
1.5 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

EdmontonEdmonton1.4 TFLOPSFP32
x1
4-Core A194-Core A193.01 TFLOPSFP8-16 Tensor
x2.14

Clock Speed
··
Clock Speed
··
Peak OPS
1.4 TFLOPSFP32
Peak OPS
3.01 TFLOPSFP8-16 Tensor
-
Tensor FP8-16
3.01 TFLOPS
Tensor FP8-32
3.01 TFLOPS
-
Tensor FP16-16
1.5 TFLOPS
Tensor FP16-32
1.5 TFLOPS
FP32
1.4 TFLOPS
FP32
1.5 TFLOPS
Pixel Rate
14.6 GPixel/s
Pixel Rate
23.5 GPixel/s
Texture Rate
43.9 GTexel/s
Texture Rate
47 GTexel/s

Shaders
768 Shaders
Shaders
512 Shaders
TMUs
48 TMUs
TMUs
32 TMUs
ROPs
16 ROPs
ROPs
16 ROPs
Tensor Cores
-
Tensor Cores
4 T-Cores
RT Cores
-
RT Cores
4 RT-Cores
CUs
12 CUs
EUs
64 EUs

Boost Clock
914MHz
Boost Clock
1.47GHz

L2 Cache
512KB shared
L2 Cache
1MB shared

Shared Memory
Shared MemoryLPDDR5X
Memory Bus
256-bit
Memory Bus
64-bit
Memory Speed
2.1GT/s
Memory Speed
8.5GT/s
Memory Bandwidth
68.3GB/s
Memory Bandwidth
68.3GB/s
ESRAM
32MBSize
218GB/sBandwidth
ESRAM
-

Multi-Monitor
1
Multi-Monitor
1

-
Encoder Model
Apple Media Engine 3

-
Decoder Model
Apple Media Engine 3

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
XBOX branding
Branding
A19 branding
Codename
-
Codename
G18A
Chip Variant
M1004145-001
Chip Variant
-
Market Segment
Console
Market Segment
Smartphone
Release Date
Aug 2, 2016
Release Date
Mar 2, 2026

Foundry
TSMC
Foundry
TSMC
Fabrication Node
16FF
Fabrication Node
N3P
Die Size
240mm²
Die Size
83mm²
Transistor Count
5 Billion
Transistor Count
14.3 Billion
Transistor Density
21 MTr/mm²
Transistor Density
172 MTr/mm²

No images available
No images available

CPUs
CPUs
Smartphones
-
Smartphones