AMD FirePro M3900 Full Specs - HMC

160 Shaders

700MHz

1GB DDR314.4GB/s

··

224 GFLOPS

Form Factor

Soldered

TDP

15W

Clock Speed

··

Peak OPS

224 GFLOPSFP32

FP32

224 GFLOPS

Pixel Rate

2.8 GPixel/s

Texture Rate

5.6 GTexel/s

Shaders

160 Shaders

TMUs

8 TMUs

ROPs

4 ROPs

CUs

2 CUs

Boost Clock

700MHz

L1

8KB/CU

L2 Cache

128KB shared

1GB DDR3

Memory Bus

64-bit

Memory Speed

1.8GT/s

Memory Bandwidth

14.4GB/s

ECC

No

TDP

15W

Max Resolution

2560x1600

Refresh Rate Calculator

2560x1440

Resolution1440p QHD

Refresh Rate

66Hz

Multi-Monitor

2

DSC

Not Supported

Shader Model

5

DirectX

DirectX 11

Direct3D

11_0

OpenGL

4.5

OpenCL

1.2

GFX

4

Decoder

UVD 3.0

Codec

MPEG-1

MPEG-2

MPEG-4

VC-1

AVC (H.264)

Form Factor

Soldered

PCIe

PCIe 2.1 x16

Manufacturer

Chip Designer

Architecture

Family

Branding

FirePro 2011 branding

Codename

Caicos

Chip Variant

Caicos

Market Segment

Laptop

Release Date

Apr 13, 2011

Foundry

TSMC

Fabrication Node

40nm

Die Size

67mm²

Transistor Count

370M

Transistor Density

5.52 MTr/mm²