AMD FirePro M3900 vs AMD FirePro M8900 Full Specs
160 Shaders 700MHz | 1,920 Shaders 680MHz |
1GB DDR314.4GB/s | 4GB GDDR5230.4GB/s |
·· 224 GFLOPS | ·· 2.61 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 15W | TDP 35W |
Clock Speed ·· | Clock Speed ·· |
Peak OPS 224 GFLOPSFP32 | Peak OPS 2.61 TFLOPSFP32 |
FP32 224 GFLOPS | FP32 2.61 TFLOPS |
Pixel Rate 2.8 GPixel/s | Pixel Rate 21.8 GPixel/s |
Texture Rate 5.6 GTexel/s | Texture Rate 32.6 GTexel/s |
Shaders 160 Shaders | Shaders 1,920 Shaders |
TMUs 8 TMUs | TMUs 96 TMUs |
ROPs 4 ROPs | ROPs 64 ROPs |
CUs 2 CUs | CUs 24 CUs |
Boost Clock 700MHz | Boost Clock 680MHz |
L2 Cache 128KB shared | L2 Cache 512KB shared |
1GB DDR3 | 4GB GDDR5 |
Memory Bus 64-bit | Memory Bus 256-bit |
Memory Speed 1.8GT/s | Memory Speed 3.6GT/s |
Memory Bandwidth 14.4GB/s | Memory Bandwidth 230.4GB/s |
ECC No | ECC No |
TDP 15W | TDP 35W |
Multi-Monitor 2 | Multi-Monitor 2 |
Decoder Model UVD 3.0 | Decoder Model UVD 3.0 |
Form Factor Soldered | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Caicos | Codename Barts |
Chip Variant Caicos | Chip Variant Barts LE |
Market Segment Laptop | Market Segment Laptop |
Release Date Apr 13, 2011 | Release Date Apr 12, 2011 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 40nm | Fabrication Node 40nm |
Die Size 67mm² | Die Size 255mm² |
Transistor Count 370 Million | Transistor Count 1.7 Billion |
Transistor Density 5.52 MTr/mm² | Transistor Density 6.67 MTr/mm² |
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