AMD FirePro S10000 Passive vs MSI GeForce RTX 3050 LP 6G OC Full Specs
3,584 Shaders 825MHz | 2,304 Shaders 1.49GHz |
6GB GDDR5480GB/s | 6GB GDDR6168GB/s |
·· 5.91 TFLOPS | ·· 6.88 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 375W | TDP 70W |
Power Connectors 2x 8-Pin | Power Connectors - |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 5.91 TFLOPSFP32 | Peak OPS 220 TOPSINT4 Tensor Sparse |
- | Tensor FP16-16 27.5 TFLOPSFP16-16 Tensor Sparse 55 TFLOPSTensor FP16-32 13.75 TFLOPSFP16-32 Tensor Sparse 27.5 TFLOPS |
- | BF16 6.88 TFLOPSTensor BF16 13.75 TFLOPSBF16 Tensor Sparse 27.5 TFLOPS |
Tensor TF32 - | Tensor TF32 6.88 TFLOPS |
FP32 5.91 TFLOPS | FP32 6.88 TFLOPS |
FP64 1.48 TFLOPS | FP64 107.4 GFLOPS |
Tensor INT4 - | Tensor INT4 110 TOPS |
- | Tensor INT8 55 TOPS |
Ray - | Ray 10.37 TOPS |
Pixel Rate 26.4 GPixel/s | Pixel Rate 47.7 GPixel/s |
Texture Rate 92.4 GTexel/s | Texture Rate 107.4 GTexel/s |
Shaders 3,584 Shaders | Shaders 2,304 Shaders |
TMUs 224 TMUs | TMUs 72 TMUs |
ROPs 64 ROPs | ROPs 32 ROPs |
Tensor Cores - | Tensor Cores 72 T-Cores |
RT Cores - | RT Cores 18 RT-Cores |
CUs 56 CUs | SMs 18 SMs |
Base Clock - | Base Clock 1.04GHz |
Boost Clock 825MHz | Boost Clock 1.49GHz |
L2 Cache 768KB shared | L2 Cache 2MB shared |
6GB GDDR5 | 6GB GDDR6 |
Memory Bus 384-bit | Memory Bus 96-bit |
Memory Speed 5GT/s | Memory Speed 14GT/s |
Memory Bandwidth 480GB/s | Memory Bandwidth 168GB/s |
TDP 375W | TDP 70W |
Multi-Monitor 6 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
- | 1x DisplayPort 1.4 |
- | 2x HDMI 2.1 |
Encoder Model VCE 1.0 | Encoder Model NVENC 7 |
Decoder Model UVD 3.2 | Decoder Model NVDEC 5 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2-Slots |
Height 111 mm (4.37")Width 305 mm (12.01")Depth 40 mm (1.57") | Height 69 mm (2.72")Width 174 mm (6.85")Depth 40 mm (1.57") |
Cooling Passive - | Cooling Open-Air 2x Fans |
Power Connectors 2x 8-Pin | Power Connectors - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Tahiti | Codename NV177 |
Chip Variant Tahiti LE | Chip Variant GA107-140-A1 |
Market Segment Server | Market Segment Desktop |
Release Date Nov 12, 2012 | Release Date Feb 2, 2024 |
Foundry TSMC | Foundry Samsung |
Fabrication Node 28nm | Fabrication Node 8N |
Die Size 352mm² | Die Size 200mm² |
Transistor Count 4.3 Billion | Transistor Count 8.7 Billion |
Transistor Density 12.25 MTr/mm² | Transistor Density 43.5 MTr/mm² |
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