GPUs

AMD FirePro S9300 X2 vs AMD Radeon AI PRO R9700 Full Specs

8,192 Shaders
850MHz
4,096 Shaders
2.92GHz
8GB HBM1.02TB/s
32GB GDDR6640GB/s
··
13.93 TFLOPS
··
47.84 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
300W
TDP
300W
Power Connectors
-
2x 8-Pin
Power Connectors
1x 12-Pin
-

FirePro S9300 X2FirePro S9300 X213.93 TFLOPSFP32 (2x 6.96 TFLOPS)
x1
Radeon AI PRO R9700Radeon AI PRO R97001.53 POPSINT4 Tensor Sparse
x109.93

Clock Speed
··
Clock Speed
···
Peak OPS
13.93 TFLOPSFP32
Peak OPS
1.53 POPSINT4 Tensor Sparse
-
Tensor FP8-16
191.4 TFLOPS
FP8-16 Tensor Sparse
382.7 TFLOPS
Tensor FP8-32
191.4 TFLOPS
FP8-32 Tensor Sparse
382.7 TFLOPS
-
Tensor FP16-16
95.68 TFLOPS
FP16-16 Tensor Sparse
191.4 TFLOPS
Tensor FP16-32
95.68 TFLOPS
FP16-32 Tensor Sparse
191.4 TFLOPS
-
BF16
95.68 TFLOPS
Tensor BF16
95.68 TFLOPS
BF16 Tensor Sparse
191.4 TFLOPS
FP32
13.93 TFLOPS
FP32
47.84 TFLOPS
FP64
870.4 GFLOPS
FP64
1.5 TFLOPS
Tensor INT4
-
Tensor INT4
765.5 TOPS
-
Tensor INT8
382.7 TOPS
Pixel Rate
54.4 GPixel/s
Pixel Rate
373.8 GPixel/s
Texture Rate
217.6 GTexel/s
Texture Rate
747.5 GTexel/s

Shaders
8,192 Shaders
Shaders
4,096 Shaders
TMUs
512 TMUs
TMUs
256 TMUs
ROPs
128 ROPs
ROPs
128 ROPs
Tensor Cores
-
Tensor Cores
128 T-Cores
RT Cores
-
RT Cores
64 RT-Cores
CUs
128 CUs
CUs
64 CUs

Base Clock
-
Base Clock
2.4GHz
Boost Clock
850MHz
Boost Clock
2.92GHz

L2 Cache
2MB shared
L2 Cache
8.2MB shared
L3 Cache
-
L3 Cache
64MB shared
L3 Bandwidth
-
L3 Bandwidth
2.25TB/s

8GB HBM
32GB GDDR6
Memory Bus
4096-bit
Memory Bus
256-bit
Memory Speed
1GT/s
Memory Speed
20GT/s
Memory Bandwidth
1.02TB/s
Memory Bandwidth
640GB/s

TDP
300W
TDP
300W

Multi-Monitor
4
Multi-Monitor
3
HDCP
HDCP 1.4
HDCP
HDCP 2.3

-
3x DisplayPort 2.1
-
1x HDMI 2.1

Encoder Model
VCE 3.0
Encoder Model
VCN 4.0

Decoder Model
UVD 6.0
Decoder Model
VCN 4.0

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
2-Slots
PCIe
2-Slots
Height
111 mm (4.37")
Width
267 mm (10.51")
Depth
37 mm (1.46")
Height
111 mm (4.37")
Width
241 mm (9.49")
Depth
40 mm (1.57")
Cooling
Passive
-
Cooling
Blower
1x Fan
Power Connectors
2x 8-Pin
Power Connectors
1x 12-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
FirePro 2014 branding
Branding
Radeon Pro 2023 branding
Codename
Fiji
Codename
-
Chip Variant
Fiji Pro
Chip Variant
Navi 48 XL
Market Segment
Server
Market Segment
Workstation
Release Date
Mar 31, 2016
Release Date
May 20, 2025

Foundry
TSMC
Foundry
TSMC
Fabrication Node
28nm
Fabrication Node
N4P
Die Size
596mm²
Die Size
357mm²
Transistor Count
8.9 Billion
Transistor Count
53.9 Billion
Transistor Density
14.93 MTr/mm²
Transistor Density
151.2 MTr/mm²

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