AMD FirePro W2100 vs AMD Radeon PRO W7400 Full Specs
320 Shaders 630MHz | 1,792 Shaders 1.1GHz |
2GB DDR328.8GB/s | 8GB GDDR6172.8GB/s |
·· 403.2 GFLOPS | ·· 7.88 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 26W | TDP 55W |
FirePro W2100403.2 GFLOPSFP32
Radeon PRO W740031.54 TOPSINT4 TensorClock Speed ·· | Clock Speed ··· |
Peak OPS 403.2 GFLOPSFP32 | Peak OPS 31.54 TOPSINT4 Tensor |
- | Tensor FP16-16 7.88 TFLOPSTensor FP16-32 7.88 TFLOPS |
- | BF16 15.77 TFLOPSTensor BF16 7.88 TFLOPS |
FP32 403.2 GFLOPS | FP32 7.88 TFLOPS |
FP64 25.2 GFLOPS | FP64 246.4 GFLOPS |
Tensor INT4 - | Tensor INT4 31.54 TOPS |
- | Tensor INT8 7.88 TOPS |
Pixel Rate 5 GPixel/s | Pixel Rate 70.4 GPixel/s |
Texture Rate 12.6 GTexel/s | Texture Rate 123.2 GTexel/s |
Shaders 320 Shaders | Shaders 1,792 Shaders |
TMUs 20 TMUs | TMUs 112 TMUs |
ROPs 8 ROPs | ROPs 64 ROPs |
Tensor Cores - | Tensor Cores 56 T-Cores |
RT Cores - | RT Cores 28 RT-Cores |
CUs 5 CUs | CUs 28 CUs |
Base Clock - | Base Clock 1GHz |
Boost Clock 630MHz | Boost Clock 1.1GHz |
L2 Cache 256KB shared | L2 Cache 2MB shared |
L3 Cache - | L3 Cache 32MB shared |
L3 Bandwidth - | L3 Bandwidth 1.17TB/s |
2GB DDR3 | 8GB GDDR6 |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 1.8GT/s | Memory Speed 10.8GT/s |
Memory Bandwidth 28.8GB/s | Memory Bandwidth 172.8GB/s |
TDP 26W | TDP 55W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
- | 4x DisplayPort 2.1 |
2x DisplayPort 1.2 | - |
Encoder Model VCE 1.0 | Encoder Model VCN 4.0 |
Decoder Model UVD 4.0 | Decoder Model VCN 4.0 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 1-Slots | PCIe 1-Slots |
Height 69 mm (2.72")Width 168 mm (6.61")Depth 20 mm (0.79") | Height 115 mm (4.53")Width 216 mm (8.5")Depth 20 mm (0.79") |
Cooling Blower 1x Fan | Cooling Blower 1x Fan |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Oland | Codename Hotpink Bonefish |
Chip Variant Oland XT | Chip Variant Navi 33 XL |
Market Segment Workstation | Market Segment Workstation |
Release Date Aug 13, 2014 | Release Date Aug 7, 2025 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 28nm | Fabrication Node N6 |
Die Size 77mm² | Die Size 204mm² |
Transistor Count 950 Million | Transistor Count 13.3 Billion |
Transistor Density 12.34 MTr/mm² | Transistor Density 65.2 MTr/mm² |
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