GPUs

AMD FirePro W4300 vs NVIDIA GeForce RTX 3050 6GB Full Specs

768 Shaders
930MHz
2,304 Shaders
1.47GHz
4GB GDDR596GB/s
6GB GDDR6168GB/s
··
1.43 TFLOPS
··
6.77 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
50W
TDP
70W

FirePro W4300FirePro W43001.43 TFLOPSFP32
x1
GeForce RTX 3050 6GBGeForce RTX 3050 6GB216.8 TOPSINT4 Tensor Sparse
x151.74

Clock Speed
··
Clock Speed
···
Peak OPS
1.43 TFLOPSFP32
Peak OPS
216.8 TOPSINT4 Tensor Sparse
-
Tensor FP16-16
27.1 TFLOPS
FP16-16 Tensor Sparse
54.19 TFLOPS
Tensor FP16-32
13.55 TFLOPS
FP16-32 Tensor Sparse
27.1 TFLOPS
-
BF16
6.77 TFLOPS
Tensor BF16
13.55 TFLOPS
BF16 Tensor Sparse
27.1 TFLOPS
Tensor TF32
-
Tensor TF32
6.77 TFLOPS
FP32
1.43 TFLOPS
FP32
6.77 TFLOPS
FP64
89.28 GFLOPS
FP64
105.8 GFLOPS
Tensor INT4
-
Tensor INT4
108.4 TOPS
-
Tensor INT8
54.19 TOPS
Ray
-
Ray
10.22 TOPS
Pixel Rate
14.9 GPixel/s
Pixel Rate
47 GPixel/s
Texture Rate
44.6 GTexel/s
Texture Rate
105.8 GTexel/s

Shaders
768 Shaders
Shaders
2,304 Shaders
TMUs
48 TMUs
TMUs
72 TMUs
ROPs
16 ROPs
ROPs
32 ROPs
Tensor Cores
-
Tensor Cores
72 T-Cores
RT Cores
-
RT Cores
18 RT-Cores
CUs
12 CUs
SMs
18 SMs

Base Clock
-
Base Clock
1.04GHz
Boost Clock
930MHz
Boost Clock
1.47GHz

L2 Cache
256KB shared
L2 Cache
2MB shared

4GB GDDR5
6GB GDDR6
Memory Bus
128-bit
Memory Bus
96-bit
Memory Speed
6GT/s
Memory Speed
14GT/s
Memory Bandwidth
96GB/s
Memory Bandwidth
168GB/s

TDP
50W
TDP
70W

Multi-Monitor
3
Multi-Monitor
3
HDCP
HDCP 1.4
HDCP
HDCP 2.3

-
3x DisplayPort 1.4
4x Mini DisplayPort 1.2
-
-
1x HDMI 2.1

Encoder Model
VCE 2.0
Encoder Model
NVENC 7

Decoder Model
UVD 4.2
Decoder Model
NVDEC 5

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
1-Slots
PCIe
1.9-Slots
Height
69 mm (2.72")
Width
171 mm (6.73")
Depth
20 mm (0.79")
Height
112 mm (4.41")
Width
242 mm (9.53")
Depth
38 mm (1.5")
Cooling
Blower
1x Fan
Cooling
Open-Air
2x Fans

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
FirePro 2014 branding
Branding
GeForce RTX 2018 branding
Codename
Bonaire
Codename
NV177
Chip Variant
Bonaire XT
Chip Variant
GA107-140-A1
Market Segment
Workstation
Market Segment
Desktop
Release Date
Dec 1, 2015
Release Date
Feb 2, 2024

Foundry
TSMC
Foundry
Samsung
Fabrication Node
28nm
Fabrication Node
8N
Die Size
160mm²
Die Size
200mm²
Transistor Count
2.1 Billion
Transistor Count
8.7 Billion
Transistor Density
13 MTr/mm²
Transistor Density
43.5 MTr/mm²

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