AMD FirePro W8100 Full Specs

Summary

2,560 Shaders 824MHz

8GB GDDR5320GB/s

Peak·FP32·FP16 4.22 TFLOPS

Form Factor PCIe Card

TDP 220W

Power Connectors 2x 6-Pin

Highlights

Peak OPS

Peak OPS FP32 FP64 Memory Bandwidth

FirePro W81004.22 TFLOPSFP32

x1

Top Score3.35 PFLOPS FP4 Tensor SparseDesktop1xGeForce RTX 5090

x794.54

Theoretical Performance

Clock Speed824MHz UC·Boost·OC

Peak OPS 4.22 TFLOPSFP32

FP32 4.22 TFLOPS

FP64 527.4 GFLOPS

Pixel Rate 52.7 GPixel/s

Texture Rate 131.8 GTexel/s

Core Config

Shaders 2,560 Shaders

TMUs 160 TMUs

ROPs 64 ROPs

CUs 40 CUs

Clocks

Boost Clock 824MHz

Cache

L1 16KB/CU

L2 Cache 1MB shared

Memory

8GB GDDR5

Memory Bus 512-bit

Memory Speed 5GT/s

Memory Bandwidth 320GB/s

ECC No

Power & Thermals

TDP 220W

Video Output

Max Resolution 4096x2160

Refresh Rate Calculator 3840x2160 Resolution4K UHD Refresh Rate 64Hz

Multi-Monitor 3

Adaptive Sync FreeSync

DSC Not Supported

HDCP HDCP 1.4

Ports

4x DisplayPort 1.2 1x SDI

API Support

Shader Model 6.5

DirectX DirectX 12 Direct3D 12_0

OpenGL 4.6 OpenCL 2.1 Vulkan 1.2

GFX 7

Encoder

Encoder VCE 2.0

Codec AVC (H.264)

Decoder

Decoder UVD 4.2

Codec MPEG-1 MPEG-2 MPEG-4 VC-1 AVC (H.264)

Card

Form Factor PCIe Card

PCIe PCIe 3.0 x16 2-Slots

Height 111mm (4.37") Width 279mm (10.98") Depth 37mm (1.46")

Cooling Blower 1x Fan

Power Connectors 2x 6-Pin

Multi-GPU Multi-GPU Support Supported Multi-GPU Type CrossFire XDMA

Chip

Manufacturer AMD

Chip Designer AMD

Architecture GCN 2

Family FirePro W

Branding

Codename Hawaii

Chip Variant Hawaii Pro

Market Segment Workstation

Release Date Jun 26, 2014

Fabrication

Foundry TSMC

Fabrication Node 28nm

Die Size 438mm²

Transistor Count 6.2B

Transistor Density 14.16 MTr/mm²

Images