AMD FirePro W9000 vs NVIDIA GeForce RTX 3050 6GB Full Specs
2,048 Shaders 975MHz | 2,304 Shaders 1.47GHz |
6GB GDDR5264GB/s | 6GB GDDR6168GB/s |
·· 3.99 TFLOPS | ·· 6.77 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 275W | TDP 70W |
Power Connectors 1x 8-Pin 1x 6-Pin | Power Connectors - |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 3.99 TFLOPSFP32 | Peak OPS 216.8 TOPSINT4 Tensor Sparse |
- | Tensor FP16-16 27.1 TFLOPSFP16-16 Tensor Sparse 54.19 TFLOPSTensor FP16-32 13.55 TFLOPSFP16-32 Tensor Sparse 27.1 TFLOPS |
- | BF16 6.77 TFLOPSTensor BF16 13.55 TFLOPSBF16 Tensor Sparse 27.1 TFLOPS |
Tensor TF32 - | Tensor TF32 6.77 TFLOPS |
FP32 3.99 TFLOPS | FP32 6.77 TFLOPS |
FP64 998.4 GFLOPS | FP64 105.8 GFLOPS |
Tensor INT4 - | Tensor INT4 108.4 TOPS |
- | Tensor INT8 54.19 TOPS |
Ray - | Ray 10.22 TOPS |
Pixel Rate 31.2 GPixel/s | Pixel Rate 47 GPixel/s |
Texture Rate 124.8 GTexel/s | Texture Rate 105.8 GTexel/s |
Shaders 2,048 Shaders | Shaders 2,304 Shaders |
TMUs 128 TMUs | TMUs 72 TMUs |
ROPs 32 ROPs | ROPs 32 ROPs |
Tensor Cores - | Tensor Cores 72 T-Cores |
RT Cores - | RT Cores 18 RT-Cores |
CUs 32 CUs | SMs 18 SMs |
Base Clock - | Base Clock 1.04GHz |
Boost Clock 975MHz | Boost Clock 1.47GHz |
L2 Cache 768KB shared | L2 Cache 2MB shared |
6GB GDDR5 | 6GB GDDR6 |
Memory Bus 384-bit | Memory Bus 96-bit |
Memory Speed 5.5GT/s | Memory Speed 14GT/s |
Memory Bandwidth 264GB/s | Memory Bandwidth 168GB/s |
ECC Yes | ECC - |
TDP 275W | TDP 70W |
Multi-Monitor 6 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
- | 3x DisplayPort 1.4 |
6x Mini DisplayPort 1.2 | - |
- | 1x HDMI 2.1 |
1x SDI | - |
Encoder Model VCE 1.0 | Encoder Model NVENC 7 |
Decoder Model UVD 3.2 | Decoder Model NVDEC 5 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 1.9-Slots |
Height 111 mm (4.37")Width 279 mm (10.98")Depth 37 mm (1.46") | Height 112 mm (4.41")Width 242 mm (9.53")Depth 38 mm (1.5") |
Cooling Blower 1x Fan | Cooling Open-Air 2x Fans |
Power Connectors 1x 8-Pin, 1x 6-Pin | Power Connectors - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Tahiti | Codename NV177 |
Chip Variant Tahiti LE | Chip Variant GA107-140-A1 |
Market Segment Workstation | Market Segment Desktop |
Release Date Jun 14, 2012 | Release Date Feb 2, 2024 |
Foundry TSMC | Foundry Samsung |
Fabrication Node 28nm | Fabrication Node 8N |
Die Size 352mm² | Die Size 200mm² |
Transistor Count 4.3 Billion | Transistor Count 8.7 Billion |
Transistor Density 12.25 MTr/mm² | Transistor Density 43.5 MTr/mm² |
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