GPUs

AMD FirePro W9100 vs AMD Radeon RX 9070 XT Full Specs

2,816 Shaders
930MHz
4,096 Shaders
2.97GHz
16GB GDDR5320GB/s
16GB GDDR6640GB/s
··
5.24 TFLOPS
··
48.66 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
275W
TDP
304W
Power Connectors
1x 8-Pin
1x 6-Pin
Power Connectors
2x 8-Pin
-

FirePro W9100FirePro W91005.24 TFLOPSFP32
x1
Radeon RX 9070 XTRadeon RX 9070 XT1.56 POPSINT4 Tensor Sparse
x297.29

Clock Speed
··
Clock Speed
···
Peak OPS
5.24 TFLOPSFP32
Peak OPS
1.56 POPSINT4 Tensor Sparse
-
Tensor FP8-16
194.6 TFLOPS
FP8-16 Tensor Sparse
389.3 TFLOPS
Tensor FP8-32
194.6 TFLOPS
FP8-32 Tensor Sparse
389.3 TFLOPS
-
Tensor FP16-16
97.32 TFLOPS
FP16-16 Tensor Sparse
194.6 TFLOPS
Tensor FP16-32
97.32 TFLOPS
FP16-32 Tensor Sparse
194.6 TFLOPS
-
BF16
97.32 TFLOPS
Tensor BF16
97.32 TFLOPS
BF16 Tensor Sparse
194.6 TFLOPS
FP32
5.24 TFLOPS
FP32
48.66 TFLOPS
FP64
654.7 GFLOPS
FP64
1.52 TFLOPS
Tensor INT4
-
Tensor INT4
778.6 TOPS
-
Tensor INT8
389.3 TOPS
Pixel Rate
59.5 GPixel/s
Pixel Rate
380.2 GPixel/s
Texture Rate
163.7 GTexel/s
Texture Rate
760.3 GTexel/s

Shaders
2,816 Shaders
Shaders
4,096 Shaders
TMUs
176 TMUs
TMUs
256 TMUs
ROPs
64 ROPs
ROPs
128 ROPs
Tensor Cores
-
Tensor Cores
128 T-Cores
RT Cores
-
RT Cores
64 RT-Cores
CUs
44 CUs
CUs
64 CUs

Base Clock
-
Base Clock
2.4GHz
Boost Clock
930MHz
Boost Clock
2.97GHz

L2 Cache
1MB shared
L2 Cache
8.2MB shared
L3 Cache
-
L3 Cache
64MB shared
L3 Bandwidth
-
L3 Bandwidth
2.25TB/s

16GB GDDR5
16GB GDDR6
Memory Bus
512-bit
Memory Bus
256-bit
Memory Speed
5GT/s
Memory Speed
20GT/s
Memory Bandwidth
320GB/s
Memory Bandwidth
640GB/s
ECC
No
ECC
No

TDP
275W
TDP
304W

Multi-Monitor
3
Multi-Monitor
3
HDCP
HDCP 1.4
HDCP
HDCP 2.3

-
3x DisplayPort 2.1
6x Mini DisplayPort 1.2
-
-
1x HDMI 2.1
1x SDI
-

Encoder Model
VCE 2.0
Encoder Model
VCN 4.0

Decoder Model
UVD 4.2
Decoder Model
VCN 4.0

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
2-Slots
PCIe
2.5-Slots
Height
111 mm (4.37")
Width
275 mm (10.83")
Depth
37 mm (1.46")
Height
111 mm (4.37")
Width
267 mm (10.51")
Depth
50 mm (1.97")
Cooling
Blower
1x Fan
Cooling
Open-Air
3x Fans
Power Connectors
1x 8-Pin, 1x 6-Pin
Power Connectors
2x 8-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
FirePro 2014 branding
Branding
Radeon 2023 branding
Codename
Hawaii
Codename
-
Chip Variant
Hawaii Pro
Chip Variant
Navi 48 XL
Market Segment
Workstation
Market Segment
Desktop
Release Date
Mar 26, 2014
Release Date
Jan 6, 2025

Foundry
TSMC
Foundry
TSMC
Fabrication Node
28nm
Fabrication Node
N4P
Die Size
438mm²
Die Size
357mm²
Transistor Count
6.2 Billion
Transistor Count
53.9 Billion
Transistor Density
14.16 MTr/mm²
Transistor Density
151.2 MTr/mm²

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