AMD Neo vs NVIDIA RSX-3 Full Specs
2,304 Shaders 911MHz | 24 Shaders 550MHz |
Shared Memory | 262MB GDDR320.8GB/s |
·· 4.2 TFLOPS | ·· 192 GFLOPS |
Form Factor iGPU | Form Factor Soldered |
TDP 150W | TDP 35W |
Neo4.2 TFLOPSFP32
RSX-3192 GFLOPSFP32Clock Speed ·· | Clock Speed ·· |
Peak OPS 4.2 TFLOPSFP32 | Peak OPS 192 GFLOPSFP32 |
FP32 4.2 TFLOPS | FP32 192 GFLOPS |
Pixel Rate 29.1 GPixel/s | Pixel Rate 4.4 GPixel/s |
Texture Rate 131.2 GTexel/s | Texture Rate 13.2 GTexel/s |
Shaders 2,304 Shaders | Shaders 24 Shaders |
TMUs 144 TMUs | TMUs 24 TMUs |
ROPs 32 ROPs | ROPs 8 ROPs |
CUs 36 CUs | Units - |
Boost Clock 911MHz | Boost Clock 550MHz |
Shared Memory | 262MB GDDR3 |
Memory Bus 256-bit | Memory Bus 128-bit |
Memory Speed 6.8GT/s | Memory Speed 1.3GT/s |
Memory Bandwidth 217.6GB/s | Memory Bandwidth 20.8GB/s |
TDP 150W | TDP 35W |
Multi-Monitor 1 | Multi-Monitor 1 |
Form Factor iGPU | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename - | Codename Reality Synthesizer |
Chip Variant CXD90044GB | Chip Variant RSX-CXD5302 |
Market Segment Console | Market Segment Console |
Release Date Nov 10, 2016 | Release Date Oct 4, 2012 |
Foundry TSMC | Foundry Sony |
Fabrication Node 16FF | Fabrication Node 40nm |
Die Size 322mm² | Die Size 114mm² |
Transistor Count 5.7 Billion | Transistor Count 302 Million |
Transistor Density 18 MTr/mm² | Transistor Density 2.65 MTr/mm² |
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CPUs | CPUs - |