GPUs

AMD Radeon 740M 2500MHz vs AMD Radeon R2 2CU 300MHz GCN 2 Full Specs

256 Shaders
2.5GHz
128 Shaders
300MHz
Shared Memory120GB/s
·
Shared Memory25.6GB/s
·
··
1.28 TFLOPS
··
76.8 GFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Radeon 740M 2500MHzRadeon 740M 2500MHz2.56 TFLOPSFP16
x33.33
Radeon R2 2CU 300MHz GCN 2Radeon R2 2CU 300MHz GCN 276.8 GFLOPSFP32
x1

Clock Speed
···
Clock Speed
··
Peak OPS
2.56 TFLOPSFP16
Peak OPS
76.8 GFLOPSFP32
BF16
2.56 TFLOPS
-
FP32
1.28 TFLOPS
FP32
76.8 GFLOPS
FP64
80 GFLOPS
FP64
4.8 GFLOPS
Pixel Rate
20 GPixel/s
Pixel Rate
1.2 GPixel/s
Texture Rate
40 GTexel/s
Texture Rate
2.4 GTexel/s

Shaders
256 Shaders
Shaders
128 Shaders
TMUs
16 TMUs
TMUs
8 TMUs
ROPs
8 ROPs
ROPs
4 ROPs
RT Cores
4 RT-Cores
RT Cores
-
CUs
4 CUs
CUs
2 CUs

Base Clock
1.5GHz
Base Clock
-
Boost Clock
2.5GHz
Boost Clock
300MHz

L2 Cache
-
L2 Cache
64KB shared

Shared Memory
·
Shared Memory
·
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
7.5GT/s
Memory Speed
1.6GT/s
Memory Bandwidth
120GB/s
Memory Bandwidth
25.6GB/s
ECC
No
ECC
No

Multi-Monitor
4
Multi-Monitor
3
HDCP
HDCP 2.2
HDCP
-

Encoder Model
VCN 4.0
Encoder Model
VCE 2.0

Decoder Model
VCN 4.0
Decoder Model
UVD 4.2

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2023 branding
Branding
Radeon 2013 branding
Codename
Phoenix
Codename
Kalindi
Chip Variant
-
Chip Variant
Kalindi LP
Market Segment
Laptop
Market Segment
Laptop
Release Date
May 3, 2023
Release Date
Apr 29, 2014

Foundry
TSMC
Foundry
GlobalFoundries
Fabrication Node
N4
Fabrication Node
28nm
Die Size
137mm²
Die Size
107mm²
Transistor Count
20.9 Billion
Transistor Count
930 Million
Transistor Density
153 MTr/mm²
Transistor Density
9 MTr/mm²

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