GPUs

AMD Radeon 840M 2900MHz vs NVIDIA GeForce RTX 3050 Ti Laptop 80W Full Specs

256 Shaders
2.9GHz
2,560 Shaders
1.7GHz
Shared Memory128GB/s
·
4GB GDDR6192GB/s
··
1.49 TFLOPS
··
8.68 TFLOPS
Form Factor
iGPU
Form Factor
Soldered
TDP
Shared
TDP
80W

Clock Speed
···
Clock Speed
···
Peak OPS
2.97 TFLOPSFP16
Peak OPS
277.7 TOPSINT4 Tensor Sparse
-
Tensor FP16-16
34.71 TFLOPS
FP16-16 Tensor Sparse
69.43 TFLOPS
Tensor FP16-32
17.36 TFLOPS
FP16-32 Tensor Sparse
34.71 TFLOPS
BF16
2.97 TFLOPS
Tensor BF16
-
BF16 Tensor Sparse
-
BF16
8.68 TFLOPS
Tensor BF16
17.36 TFLOPS
BF16 Tensor Sparse
34.71 TFLOPS
Tensor TF32
-
Tensor TF32
8.68 TFLOPS
FP32
1.49 TFLOPS
FP32
8.68 TFLOPS
FP64
92.8 GFLOPS
FP64
135.6 GFLOPS
Tensor INT4
-
Tensor INT4
138.9 TOPS
-
Tensor INT8
69.43 TOPS
Ray
-
Ray
13.09 TOPS
Pixel Rate
92.8 GPixel/s
Pixel Rate
54.2 GPixel/s
Texture Rate
46.4 GTexel/s
Texture Rate
135.6 GTexel/s

Shaders
256 Shaders
Shaders
2,560 Shaders
TMUs
16 TMUs
TMUs
80 TMUs
ROPs
32 ROPs
ROPs
32 ROPs
Tensor Cores
-
Tensor Cores
80 T-Cores
RT Cores
4 RT-Cores
RT Cores
20 RT-Cores
CUs
4 CUs
SMs
20 SMs

Base Clock
1.5GHz
Base Clock
1.46GHz
Boost Clock
2.9GHz
Boost Clock
1.7GHz

L2 Cache
-
L2 Cache
2MB shared

Shared Memory
·
4GB GDDR6
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
8GT/s
Memory Speed
12GT/s
Memory Bandwidth
128GB/s
Memory Bandwidth
192GB/s
ECC
No
ECC
No

TDP
Shared
TDP
80W

Multi-Monitor
4
Multi-Monitor
3
HDCP
HDCP 2.3
HDCP
HDCP 2.3

Encoder Model
VCN 4.0
Encoder Model
NVENC 7
Codec
VP9
AVC (H.264)
HEVC (H.265)
AV1
Codec
-
AVC (H.264)
HEVC (H.265)
-

Decoder Model
VCN 4.0
Decoder Model
NVDEC 5
Codec
MPEG-1
MPEG-2
MPEG-4
JPEG
VC-1
-
VP9
AVC (H.264)
HEVC (H.265)
AV1
Codec
MPEG-1
MPEG-2
MPEG-4
-
VC-1
VP8
VP9
AVC (H.264)
HEVC (H.265)
AV1

Form Factor
iGPU
Form Factor
Soldered

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2023 branding
Branding
GeForce RTX 2018 branding
Codename
Strix Point
Codename
NV177
Chip Variant
-
Chip Variant
GA107-140-A1
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jan 6, 2025
Release Date
May 11, 2021

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N4P
Fabrication Node
8N
Die Size
233mm²
Die Size
200mm²
Transistor Count
28 Billion
Transistor Count
8.7 Billion
Transistor Density
120 MTr/mm²
Transistor Density
43.5 MTr/mm²