AMD Radeon 860M 8CU 3100MHz vs AMD Radeon PRO W7400 Full Specs
512 Shaders 3.1GHz | 1,792 Shaders 1.1GHz |
Shared Memory136.5GB/s · | 8GB GDDR6172.8GB/s placeholder |
·· 3.17 TFLOPS | ·· 7.88 TFLOPS |
Form Factor iGPU | Form Factor PCIe Card |
TDP Shared | TDP 55W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 6.35 TFLOPSFP16 | Peak OPS 31.54 TOPSINT4 Tensor |
- | Tensor FP16-16 7.88 TFLOPSTensor FP16-32 7.88 TFLOPS |
BF16 6.35 TFLOPSTensor BF16 - | BF16 15.77 TFLOPSTensor BF16 7.88 TFLOPS |
FP32 3.17 TFLOPS | FP32 7.88 TFLOPS |
FP64 198.4 GFLOPS | FP64 246.4 GFLOPS |
Tensor INT4 - | Tensor INT4 31.54 TOPS |
- | Tensor INT8 7.88 TOPS |
Pixel Rate 99.2 GPixel/s | Pixel Rate 70.4 GPixel/s |
Texture Rate 99.2 GTexel/s | Texture Rate 123.2 GTexel/s |
Shaders 512 Shaders | Shaders 1,792 Shaders |
TMUs 32 TMUs | TMUs 112 TMUs |
ROPs 32 ROPs | ROPs 64 ROPs |
Tensor Cores - | Tensor Cores 56 T-Cores |
RT Cores 6 RT-Cores | RT Cores 28 RT-Cores |
CUs 8 CUs | CUs 28 CUs |
Base Clock 1.5GHz | Base Clock 1GHz |
Boost Clock 3.1GHz | Boost Clock 1.1GHz |
L0 Cache 32KB/WGP | L0 Cache 64KB/WGP |
L1 256KB/Array | L1 256KB/Array |
L2 Cache - | L2 Cache 2MB shared |
L3 Cache - | L3 Cache 32MB shared |
L3 Bandwidth - | L3 Bandwidth 1.17TB/s |
Shared Memory · | 8GB GDDR6 placeholder |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 8.5GT/s | Memory Speed 10.8GT/s |
Memory Bandwidth 136.5GB/s | Memory Bandwidth 172.8GB/s |
ECC - | ECC No |
TDP Shared | TDP 55W |
Max Resolution 4096x2160 | Max Resolution 7680x4320 |
Refresh Rate Calculator 3840x2160 Resolution4K UHD Refresh Rate 64Hz | Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 165Hz |
Multi-Monitor 4 | Multi-Monitor 3 |
Adaptive Sync FreeSync | Adaptive Sync FreeSync |
DSC Not Supported | DSC Supported |
HDCP HDCP 2.3 | HDCP HDCP 2.3 |
- | 4x DisplayPort 2.1 |
Shader Model 6.7 | Shader Model 6.7 |
DirectX DirectX 12Direct3D 12_2 | DirectX DirectX 12Direct3D 12_2 |
OpenGL 4.6OpenCL 2.1Vulkan 1.3 | OpenGL 4.6OpenCL 2.2Vulkan 1.3 |
GFX 11.5 | GFX 11 |
Encoder VCN 4.0 | Encoder VCN 4.0 |
Codec VP9 AVC (H.264) HEVC (H.265) AV1 | Codec VP9 AVC (H.264) HEVC (H.265) AV1 |
Decoder VCN 4.0 | Decoder VCN 4.0 |
Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 VP9 AVC (H.264) HEVC (H.265) AV1 | Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 VP9 AVC (H.264) HEVC (H.265) AV1 |
Form Factor iGPU | Form Factor PCIe Card |
PCIe - | PCIe PCIe 4.0 x8 1-Slots |
- | Height 115mm (4.53")Width 216mm (8.5")Depth 20mm (0.79") |
Cooling Open-Air - | Cooling Blower 1x Fan |
Multi-GPU - | Multi-GPU Multi-GPU Support SupportedMulti-GPU Type CrossFire XDMA |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Gorgon Point | Codename Hotpink Bonefish |
Chip Variant - | Chip Variant Navi 33 XL |
Market Segment Laptop | Market Segment Workstation |
Release Date Mar 2, 2026 | Release Date Aug 7, 2025 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N4P | Fabrication Node N6 |
Die Size 233mm² | Die Size 204mm² |
Transistor Count 28B | Transistor Count 13.3B |
Transistor Density 120 MTr/mm² | Transistor Density 65.2 MTr/mm² |





