AMD Radeon 880M 2900MHz vs Intel Arc B370 2400MHz Full Specs

Summary

768 Shaders 2.9GHz	1,280 Shaders 2.4GHz
Shared Memory128GB/s LPDDR5X·DDR5	Shared Memory136.5GB/sLPDDR5X
Peak·FP32·FP16 4.45 TFLOPS	Peak·FP32·FP16 6.14 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 BF16 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth

Radeon 880M 2900MHz8.91 TFLOPSFP16

x1

Arc B370 2400MHz196.6 TOPSINT4 Tensor

x22.07

Show Top Score

Theoretical Performance

Clock Speed2900MHz UC·Base·Boost·OC	Clock Speed2400MHz UC·Boost·OC
Peak OPS 8.91 TFLOPSFP16	Peak OPS 196.6 TOPSINT4 Tensor
-	Tensor FP16-32 49.15 TFLOPS
BF16 8.91 TFLOPS Tensor BF16 -	BF16 - Tensor BF16 49.15 TFLOPS
FP32 4.45 TFLOPS	FP32 6.14 TFLOPS
FP64 278.4 GFLOPS	FP64 1.54 TFLOPS
Tensor INT4 -	Tensor INT4 196.6 TOPS
-	Tensor INT8 98.3 TOPS
Pixel Rate 92.8 GPixel/s	Pixel Rate 96 GPixel/s
Texture Rate 139.2 GTexel/s	Texture Rate 192 GTexel/s

Core Config

Shaders 768 Shaders	Shaders 1,280 Shaders
TMUs 48 TMUs	TMUs 80 TMUs
ROPs 32 ROPs	ROPs 40 ROPs
Tensor Cores -	Tensor Cores 80 T-Cores
RT Cores 12 RT-Cores	RT Cores 10 RT-Cores
CUs 12 CUs	EUs 80 EUs

Clocks

Base Clock 1.5GHz	Base Clock -
Boost Clock 2.9GHz	Boost Clock 2.4GHz

Cache

L2 Cache -

L2 Cache 16.4MB shared

Memory

Shared Memory LPDDR5X·DDR5	Shared MemoryLPDDR5X
Memory Bus 128-bit	Memory Bus 128-bit
Memory Speed 8GT/s	Memory Speed 8.5GT/s
Memory Bandwidth 128GB/s	Memory Bandwidth 136.5GB/s

Video Output

Multi-Monitor 4	Multi-Monitor 3
HDCP HDCP 2.3	HDCP -

Encoder

Encoder Model VCN 4.0

Encoder Model Xe Media Engine

Decoder

Decoder Model VCN 4.0

Decoder Model Xe Media Engine

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer AMD	Manufacturer Intel
Chip Designer AMD	Chip Designer Intel
Architecture RDNA 3.5	Architecture Battlemage
Family 800	Family Gen 13
Branding	Branding
Codename Strix Point	Codename Xe3 LPG
Chip Variant -	Chip Variant GT1
Market Segment Laptop	Market Segment Laptop
Release Date Jun 2, 2024	Release Date Jan 5, 2026

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node N4P	Fabrication Node Intel 3
Die Size 233mm²	Die Size 27mm²
Transistor Count 28 Billion	Transistor Count -
Transistor Density 120 MTr/mm²	Transistor Density -

Images

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Used In

CPUs Ryzen AI 9 365

CPUs Core Ultra 5 338H

Competitors

AMDRadeon 880M 2900MHz vs GPU Apple10-Core M5 AMDRadeon 880M 2900MHz vs GPU AMDRadeon 840M 2900MHz AMDRadeon 880M 2900MHz vs GPU AMDRadeon 860M 3000MHz Show 12 more

IntelArc B370 2400MHz vs GPU IntelArc B390 2500MHz IntelArc B370 2400MHz vs GPU QualcommAdreno X2-85 5.2T IntelArc B370 2400MHz vs GPU AMDRadeon 8040S Show 12 more