GPUs

AMD Radeon AI PRO R9700 vs NVIDIA V100 Full Specs

4,096 Shaders
2.92GHz
5,120 Shaders
1.38GHz
32GB GDDR6640GB/s
32GB HBM2896GB/s
··
47.84 TFLOPS
··
14.13 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
300W
TDP
250W
Power Connectors
1x 12-Pin
-
Power Connectors
-
2x 8-Pin

Radeon AI PRO R9700Radeon AI PRO R97001.53 POPSINT4 Tensor Sparse
x13.54
V100V100113 TFLOPSFP16-16 Tensor
x1

Clock Speed
···
Clock Speed
···
Peak OPS
1.53 POPSINT4 Tensor Sparse
Peak OPS
113 TFLOPSFP16-16 Tensor
Tensor FP8-16
191.4 TFLOPS
FP8-16 Tensor Sparse
382.7 TFLOPS
Tensor FP8-32
191.4 TFLOPS
FP8-32 Tensor Sparse
382.7 TFLOPS
-
Tensor FP16-16
95.68 TFLOPS
FP16-16 Tensor Sparse
191.4 TFLOPS
Tensor FP16-32
95.68 TFLOPS
FP16-32 Tensor Sparse
191.4 TFLOPS
Tensor FP16-16
113 TFLOPS
FP16-16 Tensor Sparse
-
Tensor FP16-32
113 TFLOPS
FP16-32 Tensor Sparse
-
BF16
95.68 TFLOPS
Tensor BF16
95.68 TFLOPS
BF16 Tensor Sparse
191.4 TFLOPS
-
FP32
47.84 TFLOPS
FP32
14.13 TFLOPS
FP64
1.5 TFLOPS
FP64
7.07 TFLOPS
Tensor INT4
765.5 TOPS
Tensor INT4
-
Tensor INT8
382.7 TOPS
-
Pixel Rate
373.8 GPixel/s
Pixel Rate
176.6 GPixel/s
Texture Rate
747.5 GTexel/s
Texture Rate
441.6 GTexel/s

Shaders
4,096 Shaders
Shaders
5,120 Shaders
TMUs
256 TMUs
TMUs
320 TMUs
ROPs
128 ROPs
ROPs
128 ROPs
Tensor Cores
128 T-Cores
Tensor Cores
640 T-Cores
RT Cores
64 RT-Cores
RT Cores
-
CUs
64 CUs
SMs
80 SMs

Base Clock
2.4GHz
Base Clock
1.23GHz
Boost Clock
2.92GHz
Boost Clock
1.38GHz

L2 Cache
8.2MB shared
L2 Cache
6.1MB shared
L3 Cache
64MB shared
L3 Cache
-
L3 Bandwidth
2.25TB/s
L3 Bandwidth
-

32GB GDDR6
32GB HBM2
Memory Bus
256-bit
Memory Bus
4096-bit
Memory Speed
20GT/s
Memory Speed
1.8GT/s
Memory Bandwidth
640GB/s
Memory Bandwidth
896GB/s

TDP
300W
TDP
250W

Multi-Monitor
3
Multi-Monitor
-
HDCP
HDCP 2.3
HDCP
-

3x DisplayPort 2.1
-
1x HDMI 2.1
-

Encoder Model
VCN 4.0
Encoder Model
3x NVENC 5

Decoder Model
VCN 4.0
Decoder Model
NVDEC 3

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
2-Slots
PCIe
2-Slots
Height
111 mm (4.37")
Width
241 mm (9.49")
Depth
40 mm (1.57")
Height
111 mm (4.37")
Width
267 mm (10.51")
Depth
40 mm (1.57")
Cooling
Blower
1x Fan
Cooling
Passive
-
Power Connectors
1x 12-Pin
Power Connectors
2x 8-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon Pro 2023 branding
Branding
V100 branding
Codename
-
Codename
NV140
Chip Variant
Navi 48 XL
Chip Variant
GV100-400-A1
Market Segment
Workstation
Market Segment
Server
Release Date
May 20, 2025
Release Date
Mar 27, 2018

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N4P
Fabrication Node
12FFN
Die Size
357mm²
Die Size
815mm²
Transistor Count
53.9 Billion
Transistor Count
21.1 Billion
Transistor Density
151.2 MTr/mm²
Transistor Density
25.89 MTr/mm²

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