AMD Radeon E8950 vs NVIDIA A16 Full Specs
2,048 Shaders 735MHz | 5,120 Shaders 1.7GHz |
8GB GDDR5192GB/s | 64GB GDDR6463.4GB/s |
·· 3.01 TFLOPS | ·· 17.36 TFLOPS |
Form Factor MXM-B | Form Factor PCIe Card |
TDP 95W | TDP 250W |
Power Connectors - | Power Connectors 1x 8-Pin EPS |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 3.01 TFLOPSFP32 | Peak OPS 555.4 TOPSINT4 Tensor Sparse |
- | Tensor FP16-16 69.43 TFLOPSFP16-16 Tensor Sparse 138.9 TFLOPSTensor FP16-32 34.71 TFLOPSFP16-32 Tensor Sparse 69.43 TFLOPS |
- | BF16 17.36 TFLOPSTensor BF16 34.71 TFLOPSBF16 Tensor Sparse 69.43 TFLOPS |
Tensor TF32 - | Tensor TF32 17.36 TFLOPS |
FP32 3.01 TFLOPS | FP32 17.36 TFLOPS |
FP64 188.2 GFLOPS | FP64 271.2 GFLOPS |
Tensor INT4 - | Tensor INT4 277.7 TOPS |
- | Tensor INT8 138.9 TOPS |
Ray - | Ray 26.18 TOPS |
Pixel Rate 23.5 GPixel/s | Pixel Rate 54.2 GPixel/s |
Texture Rate 94.1 GTexel/s | Texture Rate 67.8 GTexel/s |
Shaders 2,048 Shaders | Shaders 5,120 Shaders |
TMUs 128 TMUs | TMUs 160 TMUs |
ROPs 32 ROPs | ROPs 128 ROPs |
Tensor Cores - | Tensor Cores 160 T-Cores |
RT Cores - | RT Cores 40 RT-Cores |
CUs 32 CUs | SMs 40 SMs |
Base Clock - | Base Clock 885MHz |
Boost Clock 735MHz | Boost Clock 1.7GHz |
L2 Cache 768KB shared | L2 Cache 2MB shared |
8GB GDDR5 | 64GB GDDR6 |
Memory Bus 256-bit | Memory Bus 128-bit |
Memory Speed 6GT/s | Memory Speed 7.2GT/s |
Memory Bandwidth 192GB/s | Memory Bandwidth 463.4GB/s |
TDP 95W | TDP 250W |
Multi-Monitor 3 | Multi-Monitor - |
HDCP HDCP 1.4 | HDCP - |
Encoder Model VCE 3.0 | Encoder Model NVENC 7 |
Decoder Model UVD 5.0 | Decoder Model NVDEC 5 |
Form Factor MXM-B | Form Factor PCIe Card |
PCIe - | PCIe 2-Slots |
- | Height 112 mm (4.41")Width 267 mm (10.51")Depth 40 mm (1.57") |
Cooling Passive | Cooling Passive |
Power Connectors - | Power Connectors 1x 8-Pin EPS |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Tonga | Codename NV177 |
Chip Variant Tonga Pro | Chip Variant GA107-140-A1 |
Market Segment Server | Market Segment Server |
Release Date Sep 1, 2015 | Release Date Apr 12, 2021 |
Foundry TSMC | Foundry Samsung |
Fabrication Node 28nm | Fabrication Node 8N |
Die Size 359mm² | Die Size 200mm² |
Transistor Count 5 Billion | Transistor Count 8.7 Billion |
Transistor Density 13.93 MTr/mm² | Transistor Density 43.5 MTr/mm² |
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