GPUs

AMD Radeon HD 6350 vs MSI GeForce RTX 3050 LP 6G OC Full Specs

80 Shaders
650MHz
2,304 Shaders
1.49GHz
524MB DDR38GB/s
6GB GDDR6168GB/s
··
104 GFLOPS
··
6.88 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
19W
TDP
70W

Radeon HD 6350Radeon HD 6350104 GFLOPSFP32
x1
GeForce RTX 3050 LP 6G OCGeForce RTX 3050 LP 6G OC220 TOPSINT4 Tensor Sparse
x2115.43

Clock Speed
··
Clock Speed
···
Peak OPS
104 GFLOPSFP32
Peak OPS
220 TOPSINT4 Tensor Sparse
-
Tensor FP16-16
27.5 TFLOPS
FP16-16 Tensor Sparse
55 TFLOPS
Tensor FP16-32
13.75 TFLOPS
FP16-32 Tensor Sparse
27.5 TFLOPS
-
BF16
6.88 TFLOPS
Tensor BF16
13.75 TFLOPS
BF16 Tensor Sparse
27.5 TFLOPS
Tensor TF32
-
Tensor TF32
6.88 TFLOPS
FP32
104 GFLOPS
FP32
6.88 TFLOPS
-
FP64
107.4 GFLOPS
Tensor INT4
-
Tensor INT4
110 TOPS
-
Tensor INT8
55 TOPS
Ray
-
Ray
10.37 TOPS
Pixel Rate
2.6 GPixel/s
Pixel Rate
47.7 GPixel/s
Texture Rate
5.2 GTexel/s
Texture Rate
107.4 GTexel/s

Shaders
80 Shaders
Shaders
2,304 Shaders
TMUs
8 TMUs
TMUs
72 TMUs
ROPs
4 ROPs
ROPs
32 ROPs
Tensor Cores
-
Tensor Cores
72 T-Cores
RT Cores
-
RT Cores
18 RT-Cores
CU
1 CU
SMs
18 SMs

Base Clock
-
Base Clock
1.04GHz
Boost Clock
650MHz
Boost Clock
1.49GHz

L2 Cache
128KB shared
L2 Cache
2MB shared

524MB DDR3
6GB GDDR6
Memory Bus
64-bit
Memory Bus
96-bit
Memory Speed
1GT/s
Memory Speed
14GT/s
Memory Bandwidth
8GB/s
Memory Bandwidth
168GB/s

TDP
19W
TDP
70W

Multi-Monitor
2
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

-
1x DisplayPort 1.4
-
2x HDMI 2.1
1x HDMI 1.3
-
1x DVI-I Dual-Link
-

-
Encoder Model
NVENC 7

Decoder Model
UVD 2.2
Decoder Model
NVDEC 5

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
1-Slots
PCIe
2-Slots
-
Height
69 mm (2.72")
Width
174 mm (6.85")
Depth
40 mm (1.57")
Cooling
Passive
-
Cooling
Open-Air
2x Fans

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2011 branding
Branding
GeForce RTX 2018 branding
Codename
Cedar
Codename
NV177
Chip Variant
Cedar Pro
Chip Variant
GA107-140-A1
Market Segment
Desktop
Market Segment
Desktop
Release Date
Apr 7, 2011
Release Date
Feb 2, 2024

Foundry
TSMC
Foundry
Samsung
Fabrication Node
40nm
Fabrication Node
8N
Die Size
59mm²
Die Size
200mm²
Transistor Count
292 Million
Transistor Count
8.7 Billion
Transistor Density
4.95 MTr/mm²
Transistor Density
43.5 MTr/mm²

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