AMD Radeon HD 6390 vs Qualcomm Adreno 722 Full Specs
320 Shaders 550MHz | 512 Shaders 450MHz |
524MB DDR216GB/s placeholder | Shared Memory33.6GB/sLPDDR5X |
·· 352 GFLOPS | ·· 460.8 GFLOPS |
Form Factor PCIe Card | Form Factor iGPU |
TDP 39W | TDP 5W |
Radeon HD 6390352 GFLOPSFP32
Adreno 722921.6 GFLOPSFP16Clock Speed ·· | Clock Speed ·· |
Peak OPS 352 GFLOPSFP32 | Peak OPS 921.6 GFLOPSFP16 |
FP32 352 GFLOPS | FP32 460.8 GFLOPS |
- | FP64 115.2 GFLOPS |
Pixel Rate 4.4 GPixel/s | Pixel Rate 7.2 GPixel/s |
Texture Rate 8.8 GTexel/s | Texture Rate 14.4 GTexel/s |
Shaders 320 Shaders | Shaders 512 Shaders |
TMUs 16 TMUs | TMUs 32 TMUs |
ROPs 8 ROPs | ROPs 16 ROPs |
CUs 4 CUs | EUs 4 EUs |
Boost Clock 550MHz | Boost Clock 450MHz |
L2 Cache 256KB shared | L2 Cache - |
524MB DDR2 placeholder | Shared MemoryLPDDR5X |
Memory Bus 128-bit | Memory Bus 32-bit |
Memory Speed 1GT/s | Memory Speed 8.4GT/s |
Memory Bandwidth 16GB/s | Memory Bandwidth 33.6GB/s |
TDP 39W | TDP 5W |
Multi-Monitor 2 | Multi-Monitor 1 |
1x HDMI 1.3 | - |
1x DVI-I Dual-Link | - |
1x VGA | - |
- | Encoder Model Hexagon |
Decoder Model UVD 2.2 | Decoder Model Hexagon |
Form Factor PCIe Card | Form Factor iGPU |
PCIe 1-Slots | PCIe - |
Cooling Passive | Cooling Open-Air |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Redwood | Codename - |
Chip Variant Redwood LE | Chip Variant - |
Market Segment Desktop | Market Segment Smartphone |
Release Date Jul 4, 2011 | Release Date May 15, 2025 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 40nm | Fabrication Node N6 |
Die Size 104mm² | Die Size - |
Transistor Count 627 Million | Transistor Count - |
Transistor Density 6.03 MTr/mm² | Transistor Density - |
No images available
No images available
CPUs - | CPUs |