AMD Radeon HD 8240 vs AMD Radeon HD 8570M Full Specs
128 Shaders 400MHz | 320 Shaders 700MHz |
Shared Memory12.8GB/sDDR3 | 1GB GDDR536GB/s placeholder |
·· 102.4 GFLOPS | ·· 448 GFLOPS |
Form Factor iGPU | Form Factor Soldered |
TDP Shared | TDP 25W |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 102.4 GFLOPSFP32 | Peak OPS 448 GFLOPSFP32 |
FP32 102.4 GFLOPS | FP32 448 GFLOPS |
FP64 6.4 GFLOPS | FP64 28 GFLOPS |
Pixel Rate 1.6 GPixel/s | Pixel Rate 5.6 GPixel/s |
Texture Rate 3.2 GTexel/s | Texture Rate 14 GTexel/s |
Shaders 128 Shaders | Shaders 320 Shaders |
TMUs 8 TMUs | TMUs 20 TMUs |
ROPs 4 ROPs | ROPs 8 ROPs |
CUs 2 CUs | CUs 5 CUs |
Base Clock - | Base Clock 650MHz |
Boost Clock 400MHz | Boost Clock 700MHz |
L2 Cache 64KB shared | L2 Cache 128KB shared |
Shared MemoryDDR3 | 1GB GDDR5 placeholder |
Memory Bus 64-bit | Memory Bus 64-bit |
Memory Speed 1.6GT/s | Memory Speed 4.5GT/s |
Memory Bandwidth 12.8GB/s | Memory Bandwidth 36GB/s |
ECC No | ECC No |
TDP Shared | TDP 25W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 1.4 |
Encoder Model VCE 2.0 | - |
Codec AVC (H.264) | Codec - |
Decoder Model UVD 4.2 | - |
Codec MPEG-1 MPEG-2 MPEG-4 VC-1 AVC (H.264) | Codec - |
Form Factor iGPU | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding |
Codename Kalindi | Codename Hainan |
Chip Variant Kalindi LP | Chip Variant Banks Pro |
Market Segment Laptop | Market Segment Laptop |
Release Date Nov 23, 2013 | Release Date Jan 8, 2013 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 28nm | Fabrication Node 28nm |
Die Size 107mm² | Die Size 56mm² |
Transistor Count 914 Million | Transistor Count 690 Million |
Transistor Density 9 MTr/mm² | Transistor Density 12.32 MTr/mm² |