AMD Radeon HD 8650M vs Qualcomm Adreno 722 Full Specs
384 Shaders 700MHz | 512 Shaders 450MHz |
1GB GDDR536GB/s placeholder | Shared Memory33.6GB/sLPDDR5X |
·· 537.6 GFLOPS | ·· 460.8 GFLOPS |
Form Factor Soldered | Form Factor iGPU |
TDP 25W | TDP 5W |
Radeon HD 8650M537.6 GFLOPSFP32
Adreno 722921.6 GFLOPSFP16Clock Speed ··· | Clock Speed ·· |
Peak OPS 537.6 GFLOPSFP32 | Peak OPS 921.6 GFLOPSFP16 |
FP32 537.6 GFLOPS | FP32 460.8 GFLOPS |
FP64 33.6 GFLOPS | FP64 115.2 GFLOPS |
Pixel Rate 5.6 GPixel/s | Pixel Rate 7.2 GPixel/s |
Texture Rate 16.8 GTexel/s | Texture Rate 14.4 GTexel/s |
Shaders 384 Shaders | Shaders 512 Shaders |
TMUs 24 TMUs | TMUs 32 TMUs |
ROPs 8 ROPs | ROPs 16 ROPs |
CUs 6 CUs | EUs 4 EUs |
Base Clock 650MHz | Base Clock - |
Boost Clock 700MHz | Boost Clock 450MHz |
L2 Cache 128KB shared | L2 Cache - |
1GB GDDR5 placeholder | Shared MemoryLPDDR5X |
Memory Bus 64-bit | Memory Bus 32-bit |
Memory Speed 4.5GT/s | Memory Speed 8.4GT/s |
Memory Bandwidth 36GB/s | Memory Bandwidth 33.6GB/s |
ECC No | ECC No |
TDP 25W | TDP 5W |
Multi-Monitor 3 | Multi-Monitor 1 |
HDCP HDCP 1.4 | HDCP - |
- | Encoder Model Hexagon |
- | Decoder Model Hexagon |
Form Factor Soldered | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Hainan | Codename - |
Chip Variant Banks Pro | Chip Variant - |
Market Segment Laptop | Market Segment Smartphone |
Release Date Jan 8, 2013 | Release Date May 15, 2025 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 28nm | Fabrication Node N6 |
Die Size 56mm² | Die Size - |
Transistor Count 690 Million | Transistor Count - |
Transistor Density 12.32 MTr/mm² | Transistor Density - |
No images available
No images available
CPUs - | CPUs |