GPUs

AMD Radeon HD 8740 vs NVIDIA GeForce RTX 3050 6GB Full Specs

512 Shaders
800MHz
2,304 Shaders
1.47GHz
1GB GDDR572GB/s
6GB GDDR6168GB/s
··
819.2 GFLOPS
··
6.77 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
55W
TDP
70W

Radeon HD 8740Radeon HD 8740819.2 GFLOPSFP32
x1
GeForce RTX 3050 6GBGeForce RTX 3050 6GB216.8 TOPSINT4 Tensor Sparse
x264.60

Clock Speed
··
Clock Speed
···
Peak OPS
819.2 GFLOPSFP32
Peak OPS
216.8 TOPSINT4 Tensor Sparse
-
Tensor FP16-16
27.1 TFLOPS
FP16-16 Tensor Sparse
54.19 TFLOPS
Tensor FP16-32
13.55 TFLOPS
FP16-32 Tensor Sparse
27.1 TFLOPS
-
BF16
6.77 TFLOPS
Tensor BF16
13.55 TFLOPS
BF16 Tensor Sparse
27.1 TFLOPS
Tensor TF32
-
Tensor TF32
6.77 TFLOPS
FP32
819.2 GFLOPS
FP32
6.77 TFLOPS
FP64
51.2 GFLOPS
FP64
105.8 GFLOPS
Tensor INT4
-
Tensor INT4
108.4 TOPS
-
Tensor INT8
54.19 TOPS
Ray
-
Ray
10.22 TOPS
Pixel Rate
12.8 GPixel/s
Pixel Rate
47 GPixel/s
Texture Rate
25.6 GTexel/s
Texture Rate
105.8 GTexel/s

Shaders
512 Shaders
Shaders
2,304 Shaders
TMUs
32 TMUs
TMUs
72 TMUs
ROPs
16 ROPs
ROPs
32 ROPs
Tensor Cores
-
Tensor Cores
72 T-Cores
RT Cores
-
RT Cores
18 RT-Cores
CUs
8 CUs
SMs
18 SMs

Base Clock
-
Base Clock
1.04GHz
Boost Clock
800MHz
Boost Clock
1.47GHz

L2 Cache
256KB shared
L2 Cache
2MB shared

1GB GDDR5
6GB GDDR6
Memory Bus
128-bit
Memory Bus
96-bit
Memory Speed
4.5GT/s
Memory Speed
14GT/s
Memory Bandwidth
72GB/s
Memory Bandwidth
168GB/s

TDP
55W
TDP
70W

Multi-Monitor
3
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

-
3x DisplayPort 1.4
1x DisplayPort 1.2
-
-
1x HDMI 2.1
1x HDMI 1.4
-
1x DVI-I Dual-Link
-

Encoder Model
VCE 1.0
Encoder Model
NVENC 7

Decoder Model
UVD 4.0
Decoder Model
NVDEC 5

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
1-Slots
PCIe
1.9-Slots
-
Height
112 mm (4.41")
Width
242 mm (9.53")
Depth
38 mm (1.5")
Cooling
Open-Air
1x Fan
Cooling
Open-Air
2x Fans

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2013 branding
Branding
GeForce RTX 2018 branding
Codename
Cape Verde
Codename
NV177
Chip Variant
Cape Verde LE
Chip Variant
GA107-140-A1
Market Segment
Desktop
Market Segment
Desktop
Release Date
Sep 5, 2013
Release Date
Feb 2, 2024

Foundry
TSMC
Foundry
Samsung
Fabrication Node
28nm
Fabrication Node
8N
Die Size
123mm²
Die Size
200mm²
Transistor Count
1.5 Billion
Transistor Count
8.7 Billion
Transistor Density
12.2 MTr/mm²
Transistor Density
43.5 MTr/mm²

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