AMD Radeon Pro Duo vs MSI GeForce RTX 3080 12GB Ventus 3X Plus OC Full Specs
8,192 Shaders 1GHz | 8,960 Shaders 1.74GHz |
8GB HBM1.02TB/s | 12GB GDDR6X912.4GB/s |
·· 16.38 TFLOPS | ·· 31.18 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 350W | TDP 350W |
Power Connectors 3x 8-Pin | Power Connectors 2x 8-Pin |
Radeon Pro Duo16.38 TFLOPSFP32 (2x 8.19 TFLOPS)
GeForce RTX 3080 12GB Ventus 3X Plus OC997.8 TOPSINT4 Tensor SparseClock Speed ·· | Clock Speed ··· |
Peak OPS 16.38 TFLOPSFP32 | Peak OPS 997.8 TOPSINT4 Tensor Sparse |
- | Tensor FP16-16 124.7 TFLOPSFP16-16 Tensor Sparse 249.4 TFLOPSTensor FP16-32 62.36 TFLOPSFP16-32 Tensor Sparse 124.7 TFLOPS |
- | BF16 31.18 TFLOPSTensor BF16 62.36 TFLOPSBF16 Tensor Sparse 124.7 TFLOPS |
Tensor TF32 - | Tensor TF32 31.18 TFLOPS |
FP32 16.38 TFLOPS | FP32 31.18 TFLOPS |
FP64 1.02 TFLOPS | FP64 487.2 GFLOPS |
Tensor INT4 - | Tensor INT4 498.9 TOPS |
- | Tensor INT8 249.4 TOPS |
Ray - | Ray 47.03 TOPS |
Pixel Rate 64 GPixel/s | Pixel Rate 194.9 GPixel/s |
Texture Rate 256 GTexel/s | Texture Rate 487.2 GTexel/s |
Shaders 8,192 Shaders | Shaders 8,960 Shaders |
TMUs 512 TMUs | TMUs 280 TMUs |
ROPs 128 ROPs | ROPs 112 ROPs |
Tensor Cores - | Tensor Cores 280 T-Cores |
RT Cores - | RT Cores 70 RT-Cores |
CUs 128 CUs | SMs 70 SMs |
Base Clock - | Base Clock 1.26GHz |
Boost Clock 1GHz | Boost Clock 1.74GHz |
L2 Cache 2MB shared | L2 Cache 5.1MB shared |
8GB HBM | 12GB GDDR6X |
Memory Bus 4096-bit | Memory Bus 384-bit |
Memory Speed 1GT/s | Memory Speed 19GT/s |
Memory Bandwidth 1.02TB/s | Memory Bandwidth 912.4GB/s |
ECC No | ECC No |
TDP 350W | TDP 350W |
Max Temp - | Max Temp 93°C Max |
Multi-Monitor 4 | Multi-Monitor 4 |
HDCP HDCP 1.4 | HDCP HDCP 2.3 |
- | 3x DisplayPort 1.4 |
3x DisplayPort 1.2 | - |
- | 1x HDMI 2.1 |
1x HDMI 1.4 | - |
Encoder Model VCE 3.0 | Encoder Model NVENC 7 |
Decoder Model UVD 6.0 | Decoder Model NVDEC 5 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2.8-Slots |
Height 111 mm (4.37")Width 277 mm (10.91")Depth 40 mm (1.57") | Height 120 mm (4.72")Width 305 mm (12.01")Depth 57 mm (2.24") |
Cooling Liquid 120mm Radiator 1x Fan | Cooling Open-Air 3x Fans |
Power Connectors 3x 8-Pin | Power Connectors 2x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Fiji | Codename NV172 |
Chip Variant Fiji Pro | Chip Variant GA102-200-KD-A1 |
Market Segment Desktop | Market Segment Desktop |
Release Date Apr 26, 2016 | Release Date Jan 27, 2022 |
Foundry TSMC | Foundry Samsung |
Fabrication Node 28nm | Fabrication Node 8N |
Die Size 596mm² | Die Size 628mm² |
Transistor Count 8.9 Billion | Transistor Count 28.3 Billion |
Transistor Density 14.93 MTr/mm² | Transistor Density 45.04 MTr/mm² |
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