AMD Radeon Pro Duo vs NVIDIA Quadro P2000 Full Specs

Summary

8,192 Shaders 1GHz	1,024 Shaders 1.48GHz
8GB HBM1.02TB/s	5GB GDDR5160.2GB/s
Peak·FP32·FP16 16.38 TFLOPS	Peak·FP32·FP16 3.03 TFLOPS
Form Factor PCIe Card	Form Factor PCIe Card
TDP 350W	TDP 75W
Power Connectors 3x 8-Pin	Power Connectors -

Theoretical Performance

Clock Speed1000MHz UC·Boost·OC	Clock Speed1480MHz UC·Base·Boost·OC
Peak OPS 16.38 TFLOPSFP32	Peak OPS 3.03 TFLOPSFP32
FP32 16.38 TFLOPS	FP32 3.03 TFLOPS
FP64 1.02 TFLOPS	FP64 94.72 GFLOPS
Pixel Rate 64 GPixel/s	Pixel Rate 59.2 GPixel/s
Texture Rate 256 GTexel/s	Texture Rate 94.7 GTexel/s

Core Config

Shaders 8,192 Shaders	Shaders 1,024 Shaders
TMUs 512 TMUs	TMUs 64 TMUs
ROPs 128 ROPs	ROPs 40 ROPs
CUs 128 CUs	SMs 8 SMs

Clocks

Base Clock -	Base Clock 1.08GHz
Boost Clock 1GHz	Boost Clock 1.48GHz

Cache

L2 Cache 2MB shared

L2 Cache 1.25MB shared

Memory

8GB HBM	5GB GDDR5
Memory Bus 4096-bit	Memory Bus 160-bit
Memory Speed 1GT/s	Memory Speed 8GT/s
Memory Bandwidth 1.02TB/s	Memory Bandwidth 160.2GB/s
ECC No	ECC No

Power & Thermals

TDP 350W

TDP 75W

Video Output

Multi-Monitor 4	Multi-Monitor 3
HDCP HDCP 1.4	HDCP -

Ports

3x DisplayPort 1.2 1x HDMI 1.4

4x DisplayPort 1.4 -

Encoder

Encoder Model VCE 3.0	Encoder Model NVENC 4
Codec AVC (H.264) HEVC (H.265)	Codec AVC (H.264) HEVC (H.265)

Decoder

Decoder Model UVD 6.0	Decoder Model NVDEC 3
Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 - AVC (H.264) HEVC (H.265)	Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP9 AVC (H.264) HEVC (H.265)

Card

Form Factor PCIe Card	Form Factor PCIe Card
PCIe 2-Slots	PCIe 1-Slots
Height 111 mm (4.37") Width 277 mm (10.91") Depth 40 mm (1.57")	Height 111 mm (4.37") Width 196 mm (7.72") Depth 20 mm (0.79")
Cooling Liquid 120mm Radiator 1x Fan	Cooling Blower 1x Fan
Power Connectors 3x 8-Pin	Power Connectors -

Chip

Manufacturer AMD	Manufacturer NVIDIA
Chip Designer AMD	Chip Designer NVIDIA
Architecture GCN 3	Architecture Pascal
Family Radeon R 300	Family Quadro P
Branding	Branding
Codename Fiji	Codename NV136
Chip Variant Fiji Pro	Chip Variant GP106-300-A1
Market Segment Desktop	Market Segment Workstation
Release Date Apr 26, 2016	Release Date Feb 6, 2017

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node 28nm	Fabrication Node 16FF
Die Size 596mm²	Die Size 200mm²
Transistor Count 8.9 Billion	Transistor Count 4.4 Billion
Transistor Density 14.93 MTr/mm²	Transistor Density 22 MTr/mm²

Images