AMD Radeon PRO W7400 vs NVIDIA A2 Full Specs
1,792 Shaders 1.1GHz | 1,280 Shaders 1.77GHz |
8GB GDDR6172.8GB/s | 16GB GDDR6100.1GB/s |
·· 7.88 TFLOPS | ·· 4.53 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 55W | TDP 60W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 31.54 TOPSINT4 Tensor | Peak OPS 145 TOPSINT4 Tensor Sparse |
Tensor FP16-16 7.88 TFLOPSFP16-16 Tensor Sparse -Tensor FP16-32 7.88 TFLOPSFP16-32 Tensor Sparse - | Tensor FP16-16 18.12 TFLOPSFP16-16 Tensor Sparse 36.25 TFLOPSTensor FP16-32 9.06 TFLOPSFP16-32 Tensor Sparse 18.12 TFLOPS |
BF16 15.77 TFLOPSTensor BF16 7.88 TFLOPSBF16 Tensor Sparse - | BF16 4.53 TFLOPSTensor BF16 9.06 TFLOPSBF16 Tensor Sparse 18.12 TFLOPS |
Tensor TF32 - | Tensor TF32 4.53 TFLOPS |
FP32 7.88 TFLOPS | FP32 4.53 TFLOPS |
FP64 246.4 GFLOPS | FP64 70.8 GFLOPS |
Tensor INT4 31.54 TOPS | Tensor INT4 72.5 TOPS |
Tensor INT8 7.88 TOPS | Tensor INT8 36.25 TOPS |
Ray - | Ray 6.83 TOPS |
Pixel Rate 70.4 GPixel/s | Pixel Rate 56.6 GPixel/s |
Texture Rate 123.2 GTexel/s | Texture Rate 70.8 GTexel/s |
Shaders 1,792 Shaders | Shaders 1,280 Shaders |
TMUs 112 TMUs | TMUs 40 TMUs |
ROPs 64 ROPs | ROPs 32 ROPs |
Tensor Cores 56 T-Cores | Tensor Cores 40 T-Cores |
RT Cores 28 RT-Cores | RT Cores 10 RT-Cores |
CUs 28 CUs | SMs 10 SMs |
Base Clock 1GHz | Base Clock 1.44GHz |
Boost Clock 1.1GHz | Boost Clock 1.77GHz |
L2 Cache 2MB shared | L2 Cache 2MB shared |
L3 Cache 32MB shared | L3 Cache - |
L3 Bandwidth 1.17TB/s | L3 Bandwidth - |
8GB GDDR6 | 16GB GDDR6 |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 10.8GT/s | Memory Speed 6.3GT/s |
Memory Bandwidth 172.8GB/s | Memory Bandwidth 100.1GB/s |
TDP 55W | TDP 60W |
Multi-Monitor 3 | Multi-Monitor - |
HDCP HDCP 2.3 | HDCP - |
4x DisplayPort 2.1 | - |
Encoder Model VCN 4.0 | Encoder Model NVENC 7 |
Decoder Model VCN 4.0 | Decoder Model NVDEC 5 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 1-Slots | PCIe 1-Slots |
Height 115 mm (4.53")Width 216 mm (8.5")Depth 20 mm (0.79") | Height 69 mm (2.72")Width 168 mm (6.61")Depth 20 mm (0.79") |
Cooling Blower 1x Fan | Cooling Passive - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Hotpink Bonefish | Codename NV177 |
Chip Variant Navi 33 XL | Chip Variant GA107-140-A1 |
Market Segment Workstation | Market Segment Server |
Release Date Aug 7, 2025 | Release Date Nov 10, 2021 |
Foundry TSMC | Foundry Samsung |
Fabrication Node N6 | Fabrication Node 8N |
Die Size 204mm² | Die Size 200mm² |
Transistor Count 13.3 Billion | Transistor Count 8.7 Billion |
Transistor Density 65.2 MTr/mm² | Transistor Density 43.5 MTr/mm² |
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