AMD Radeon PRO W7400 vs NVIDIA Quadro FX 4800 Full Specs
1,792 Shaders 1.1GHz | 192 Shaders 602MHz |
8GB GDDR6172.8GB/s | 2GB GDDR376.8GB/s |
·· 7.88 TFLOPS | ·· 462.3 GFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 55W | TDP 150W |
Power Connectors - | Power Connectors 1x 6-Pin |
Radeon PRO W740031.54 TOPSINT4 Tensor
Quadro FX 4800462.3 GFLOPSFP32Clock Speed ··· | Clock Speed ·· |
Peak OPS 31.54 TOPSINT4 Tensor | Peak OPS 462.3 GFLOPSFP32 |
Tensor FP16-16 7.88 TFLOPSTensor FP16-32 7.88 TFLOPS | - |
BF16 15.77 TFLOPSTensor BF16 7.88 TFLOPS | - |
FP32 7.88 TFLOPS | FP32 462.3 GFLOPS |
FP64 246.4 GFLOPS | FP64 57.79 GFLOPS |
Tensor INT4 31.54 TOPS | Tensor INT4 - |
Tensor INT8 7.88 TOPS | - |
Pixel Rate 70.4 GPixel/s | Pixel Rate 28.9 GPixel/s |
Texture Rate 123.2 GTexel/s | Texture Rate 77.1 GTexel/s |
Shaders 1,792 Shaders | Shaders 192 Shaders |
TMUs 112 TMUs | TMUs 64 TMUs |
ROPs 64 ROPs | ROPs 24 ROPs |
Tensor Cores 56 T-Cores | Tensor Cores - |
RT Cores 28 RT-Cores | RT Cores - |
CUs 28 CUs | SMs 24 SMs |
Base Clock 1GHz | Base Clock - |
Boost Clock 1.1GHz | Boost Clock 602MHz |
Shader Clock - | Shader Clock 1.2GHz |
L2 Cache 2MB shared | L2 Cache 256KB shared |
L3 Cache 32MB shared | L3 Cache - |
L3 Bandwidth 1.17TB/s | L3 Bandwidth - |
8GB GDDR6 | 2GB GDDR3 |
Memory Bus 128-bit | Memory Bus 384-bit |
Memory Speed 10.8GT/s | Memory Speed 1.6GT/s |
Memory Bandwidth 172.8GB/s | Memory Bandwidth 76.8GB/s |
ECC No | ECC No |
TDP 55W | TDP 150W |
Multi-Monitor 3 | Multi-Monitor 2 |
HDCP HDCP 2.3 | HDCP - |
4x DisplayPort 2.1 | - |
- | 2x DisplayPort 1.0 |
- | 1x DVI-I Dual-Link |
- | 1x SDI |
Encoder Model VCN 4.0 | - |
Decoder Model VCN 4.0 | Decoder Model VP2 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 1-Slots | PCIe 2-Slots |
Height 115 mm (4.53")Width 216 mm (8.5")Depth 20 mm (0.79") | Height 111 mm (4.37")Width 267 mm (10.51")Depth 20 mm (0.79") |
Cooling Blower 1x Fan | Cooling Blower 1x Fan |
Power Connectors - | Power Connectors 1x 6-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Hotpink Bonefish | Codename NVA0 |
Chip Variant Navi 33 XL | Chip Variant GT200-103-A2 |
Market Segment Workstation | Market Segment Workstation |
Release Date Aug 7, 2025 | Release Date Nov 11, 2008 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node 55nm |
Die Size 204mm² | Die Size 470mm² |
Transistor Count 13.3 Billion | Transistor Count 1.4 Billion |
Transistor Density 65.2 MTr/mm² | Transistor Density 2.98 MTr/mm² |
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