GPUs

AMD Radeon PRO W7500 vs Intel Arc Pro B50 Full Specs

1,792 Shaders
1.7GHz
2,048 Shaders
2.6GHz
8GB GDDR6172GB/s
16GB GDDR6224GB/s
··
12.19 TFLOPS
··
10.65 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
70W
TDP
70W
Power Connectors
-
Power Connectors
1x 8-Pin

Radeon PRO W7500Radeon PRO W750048.74 TOPSINT4 Tensor
x1
Arc Pro B50Arc Pro B50340.8 TOPSINT4 Tensor
x6.99

Clock Speed
···
Clock Speed
···
Peak OPS
48.74 TOPSINT4 Tensor
Peak OPS
340.8 TOPSINT4 Tensor
Tensor FP16-16
12.19 TFLOPS
Tensor FP16-32
12.19 TFLOPS
Tensor FP16-16
-
Tensor FP16-32
85.2 TFLOPS
BF16
24.37 TFLOPS
Tensor BF16
12.19 TFLOPS
BF16
-
Tensor BF16
85.2 TFLOPS
FP32
12.19 TFLOPS
FP32
10.65 TFLOPS
FP64
380.8 GFLOPS
FP64
2.66 TFLOPS
Tensor INT4
48.74 TOPS
Tensor INT4
340.8 TOPS
Tensor INT8
12.19 TOPS
Tensor INT8
170.4 TOPS
Pixel Rate
108.8 GPixel/s
Pixel Rate
166.4 GPixel/s
Texture Rate
190.4 GTexel/s
Texture Rate
332.8 GTexel/s

Shaders
1,792 Shaders
Shaders
2,048 Shaders
TMUs
112 TMUs
TMUs
128 TMUs
ROPs
64 ROPs
ROPs
64 ROPs
Tensor Cores
56 T-Cores
Tensor Cores
128 T-Cores
RT Cores
28 RT-Cores
RT Cores
16 RT-Cores
CUs
28 CUs
EUs
128 EUs

Base Clock
1.5GHz
Base Clock
2GHz
Boost Clock
1.7GHz
Boost Clock
2.6GHz

L2 Cache
2MB shared
L2 Cache
18.4MB shared
L3 Cache
32MB shared
L3 Cache
-
L3 Bandwidth
1.17TB/s
L3 Bandwidth
-

8GB GDDR6
16GB GDDR6
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
10.8GT/s
Memory Speed
14GT/s
Memory Bandwidth
172GB/s
Memory Bandwidth
224GB/s

TDP
70W
TDP
70W

Multi-Monitor
3
Multi-Monitor
4
HDCP
HDCP 2.3
HDCP
-

4x DisplayPort 2.1
-
-
4x Mini DisplayPort 2.1

Encoder Model
VCN 4.0
Encoder Model
Arc

Decoder Model
VCN 4.0
Decoder Model
Arc

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
1-Slots
PCIe
2-Slots
Height
115 mm (4.53")
Width
216 mm (8.5")
Depth
20 mm (0.79")
Height
69 mm (2.72")
Width
168 mm (6.61")
Depth
40 mm (1.57")
Cooling
Blower
1x Fan
Cooling
Blower
1x Fan
Power Connectors
-
Power Connectors
1x 8-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon Pro 2023 branding
Branding
Arc branding
Codename
Hotpink Bonefish
Codename
Xe2 HPG
Chip Variant
Navi 33 XL
Chip Variant
-
Market Segment
Workstation
Market Segment
Workstation
Release Date
Aug 3, 2023
Release Date
May 19, 2025

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N6
Fabrication Node
N5
Die Size
204mm²
Die Size
272mm²
Transistor Count
13.3 Billion
Transistor Count
19.6 Billion
Transistor Density
65.2 MTr/mm²
Transistor Density
72.06 MTr/mm²

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