AMD Radeon PRO W7500 vs NVIDIA GeForce GTX 1060 GDDR5X Full Specs
1,792 Shaders 1.7GHz | 1,280 Shaders 1.71GHz |
8GB GDDR6172GB/s | 6GB GDDR5X192GB/s |
·· 12.19 TFLOPS | ·· 4.37 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 70W | TDP 120W |
Power Connectors - | Power Connectors 1x 6-Pin |
Radeon PRO W750048.74 TOPSINT4 Tensor
GeForce GTX 1060 GDDR5X4.37 TFLOPSFP32Clock Speed ··· | Clock Speed ··· |
Peak OPS 48.74 TOPSINT4 Tensor | Peak OPS 4.37 TFLOPSFP32 |
Tensor FP16-16 12.19 TFLOPSTensor FP16-32 12.19 TFLOPS | - |
BF16 24.37 TFLOPSTensor BF16 12.19 TFLOPS | - |
FP32 12.19 TFLOPS | FP32 4.37 TFLOPS |
FP64 380.8 GFLOPS | FP64 136.6 GFLOPS |
Tensor INT4 48.74 TOPS | Tensor INT4 - |
Tensor INT8 12.19 TOPS | - |
Pixel Rate 108.8 GPixel/s | Pixel Rate 82 GPixel/s |
Texture Rate 190.4 GTexel/s | Texture Rate 136.6 GTexel/s |
Shaders 1,792 Shaders | Shaders 1,280 Shaders |
TMUs 112 TMUs | TMUs 80 TMUs |
ROPs 64 ROPs | ROPs 48 ROPs |
Tensor Cores 56 T-Cores | Tensor Cores - |
RT Cores 28 RT-Cores | RT Cores - |
CUs 28 CUs | SMs 10 SMs |
Base Clock 1.5GHz | Base Clock 1.51GHz |
Boost Clock 1.7GHz | Boost Clock 1.71GHz |
L2 Cache 2MB shared | L2 Cache 1.5MB shared |
L3 Cache 32MB shared | L3 Cache - |
L3 Bandwidth 1.17TB/s | L3 Bandwidth - |
8GB GDDR6 | 6GB GDDR5X |
Memory Bus 128-bit | Memory Bus 192-bit |
Memory Speed 10.8GT/s | Memory Speed 8GT/s |
Memory Bandwidth 172GB/s | Memory Bandwidth 192GB/s |
TDP 70W | TDP 120W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 2.3 | HDCP - |
4x DisplayPort 2.1 | - |
- | 3x DisplayPort 1.4 |
- | 1x HDMI 2.0 |
- | 1x DVI-D Dual-Link |
Encoder Model VCN 4.0 | Encoder Model NVENC 4 |
Decoder Model VCN 4.0 | Decoder Model NVDEC 3 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 1-Slots | PCIe 2-Slots |
Height 115 mm (4.53")Width 216 mm (8.5")Depth 20 mm (0.79") | Height 112 mm (4.41")Width 250 mm (9.84")Depth 40 mm (1.57") |
Cooling Blower 1x Fan | Cooling Blower 1x Fan |
Power Connectors - | Power Connectors 1x 6-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Hotpink Bonefish | Codename NV134 |
Chip Variant Navi 33 XL | Chip Variant GP104-140-A1 |
Market Segment Workstation | Market Segment Desktop |
Release Date Aug 3, 2023 | Release Date Oct 18, 2018 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node 16FF |
Die Size 204mm² | Die Size 314mm² |
Transistor Count 13.3 Billion | Transistor Count 7.2 Billion |
Transistor Density 65.2 MTr/mm² | Transistor Density 22.93 MTr/mm² |
No images available
No images available