GPUs

AMD Radeon PRO W7600 vs NVIDIA Quadro P620 Full Specs

2,048 Shaders
2.44GHz
512 Shaders
1.35GHz
8GB GDDR6288GB/s
2GB GDDR564.2GB/s
··
19.99 TFLOPS
··
1.39 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
130W
TDP
40W
Power Connectors
1x 8-Pin
Power Connectors
-

Radeon PRO W7600Radeon PRO W760079.95 TOPSINT4 Tensor
x57.67
Quadro P620Quadro P6201.39 TFLOPSFP32
x1

Clock Speed
···
Clock Speed
···
Peak OPS
79.95 TOPSINT4 Tensor
Peak OPS
1.39 TFLOPSFP32
Tensor FP16-16
19.99 TFLOPS
Tensor FP16-32
19.99 TFLOPS
-
BF16
39.98 TFLOPS
Tensor BF16
19.99 TFLOPS
-
FP32
19.99 TFLOPS
FP32
1.39 TFLOPS
FP64
624.6 GFLOPS
FP64
43.33 GFLOPS
Tensor INT4
79.95 TOPS
Tensor INT4
-
Tensor INT8
19.99 TOPS
-
Pixel Rate
156.2 GPixel/s
Pixel Rate
21.7 GPixel/s
Texture Rate
312.3 GTexel/s
Texture Rate
43.3 GTexel/s

Shaders
2,048 Shaders
Shaders
512 Shaders
TMUs
128 TMUs
TMUs
32 TMUs
ROPs
64 ROPs
ROPs
16 ROPs
Tensor Cores
64 T-Cores
Tensor Cores
-
RT Cores
32 RT-Cores
RT Cores
-
CUs
32 CUs
SMs
4 SMs

Base Clock
1.72GHz
Base Clock
1.27GHz
Boost Clock
2.44GHz
Boost Clock
1.35GHz

L2 Cache
2MB shared
L2 Cache
768KB shared
L3 Cache
32MB shared
L3 Cache
-
L3 Bandwidth
1.17TB/s
L3 Bandwidth
-

8GB GDDR6
2GB GDDR5
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
18GT/s
Memory Speed
4GT/s
Memory Bandwidth
288GB/s
Memory Bandwidth
64.2GB/s

TDP
130W
TDP
40W

Multi-Monitor
3
Multi-Monitor
3
HDCP
HDCP 2.3
HDCP
-

4x DisplayPort 2.1
-
-
4x Mini DisplayPort 1.4

Encoder Model
VCN 4.0
Encoder Model
NVENC 4

Decoder Model
VCN 4.0
Decoder Model
NVDEC 3

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
1-Slots
PCIe
1-Slots
Height
115 mm (4.53")
Width
241 mm (9.49")
Depth
20 mm (0.79")
Height
69 mm (2.72")
Width
150 mm (5.91")
Depth
20 mm (0.79")
Cooling
Blower
1x Fan
Cooling
Blower
1x Fan
Power Connectors
1x 8-Pin
Power Connectors
-

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon Pro 2023 branding
Branding
Quadro 2012 branding
Codename
Hotpink Bonefish
Codename
NV137
Chip Variant
Navi 33 XL
Chip Variant
GP107-300-A1
Market Segment
Workstation
Market Segment
Workstation
Release Date
Aug 3, 2023
Release Date
Feb 1, 2018

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N6
Fabrication Node
14LPP
Die Size
204mm²
Die Size
132mm²
Transistor Count
13.3 Billion
Transistor Count
3.3 Billion
Transistor Density
65.2 MTr/mm²
Transistor Density
25 MTr/mm²

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