GPUs

AMD Radeon PRO W7700 vs NVIDIA GeForce RTX 2070 Laptop Full Specs

3,072 Shaders
2.6GHz
2,304 Shaders
1.44GHz
16GB GDDR6576GB/s
8GB GDDR6448GB/s
··
31.95 TFLOPS
··
6.64 TFLOPS
Form Factor
PCIe Card
Form Factor
Soldered
TDP
190W
TDP
115W
Power Connectors
1x 8-Pin
Power Connectors
-

Radeon PRO W7700Radeon PRO W7700127.8 TOPSINT4 Tensor
x9.63
GeForce RTX 2070 LaptopGeForce RTX 2070 Laptop13.27 TFLOPSFP16
x1

Clock Speed
···
Clock Speed
···
Peak OPS
127.8 TOPSINT4 Tensor
Peak OPS
13.27 TFLOPSFP16
Tensor FP16-16
31.95 TFLOPS
Tensor FP16-32
31.95 TFLOPS
-
BF16
63.9 TFLOPS
Tensor BF16
31.95 TFLOPS
-
FP32
31.95 TFLOPS
FP32
6.64 TFLOPS
FP64
998.4 GFLOPS
FP64
207.4 GFLOPS
Tensor INT4
127.8 TOPS
Tensor INT4
-
Tensor INT8
31.95 TOPS
-
Pixel Rate
249.6 GPixel/s
Pixel Rate
92.2 GPixel/s
Texture Rate
499.2 GTexel/s
Texture Rate
207.4 GTexel/s

Shaders
3,072 Shaders
Shaders
2,304 Shaders
TMUs
192 TMUs
TMUs
144 TMUs
ROPs
96 ROPs
ROPs
64 ROPs
Tensor Cores
96 T-Cores
Tensor Cores
288 T-Cores
RT Cores
48 RT-Cores
RT Cores
36 RT-Cores
CUs
48 CUs
SMs
36 SMs

Base Clock
1.9GHz
Base Clock
1.22GHz
Boost Clock
2.6GHz
Boost Clock
1.44GHz

L2 Cache
6.1MB shared
L2 Cache
4.1MB shared
L3 Cache
64MB shared
L3 Cache
-
L3 Bandwidth
2.33TB/s
L3 Bandwidth
-

16GB GDDR6
8GB GDDR6
Memory Bus
256-bit
Memory Bus
256-bit
Memory Speed
18GT/s
Memory Speed
14GT/s
Memory Bandwidth
576GB/s
Memory Bandwidth
448GB/s

TDP
190W
TDP
115W

Multi-Monitor
3
Multi-Monitor
3
HDCP
HDCP 2.3
HDCP
HDCP 2.2

4x DisplayPort 2.1
-

Encoder Model
VCN 4.0
Encoder Model
NVENC 7

Decoder Model
VCN 4.0
Decoder Model
NVDEC 4

Form Factor
PCIe Card
Form Factor
Soldered
PCIe
2-Slots
PCIe
-
Height
111 mm (4.37")
Width
241 mm (9.49")
Depth
40 mm (1.57")
-
Cooling
Blower
1x Fan
Cooling
Open-Air
-
Power Connectors
1x 8-Pin
Power Connectors
-

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon Pro 2023 branding
Branding
GeForce RTX 2018 branding
Codename
Wheat Nas
Codename
NV166
Chip Variant
Navi 32
Chip Variant
TU106-125-A1
Market Segment
Workstation
Market Segment
Laptop
Release Date
Nov 13, 2023
Release Date
Jan 29, 2019

Foundry
TSMC
Foundry
TSMC
Other Foundries
TSMCMCD
Other Foundries
-
Fabrication Node
N5
N6MCD
Fabrication Node
12FFN
-
Die Size
200mm²
150mm²MCD
Die Size
445mm²
-
Transistor Count
28.1 Billion
8.2 BillionMCD
Transistor Count
10.8 Billion
-
Transistor Density
140.5 MTr/mm²
54.67 MTr/mm²MCD
Transistor Density
24.27 MTr/mm²
-

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All-in-Ones
-
All-in-Ones