GPUs

AMD Radeon PRO W7700 vs NVIDIA Quadro P3000 Laptop Full Specs

3,072 Shaders
2.6GHz
1,280 Shaders
1.22GHz
16GB GDDR6576GB/s
6GB GDDR5168GB/s
··
31.95 TFLOPS
··
3.11 TFLOPS
Form Factor
PCIe Card
Form Factor
Soldered
TDP
190W
TDP
75W
Power Connectors
1x 8-Pin
Power Connectors
-

Radeon PRO W7700Radeon PRO W7700127.8 TOPSINT4 Tensor
x41.09
Quadro P3000 LaptopQuadro P3000 Laptop3.11 TFLOPSFP32
x1

Clock Speed
···
Clock Speed
···
Peak OPS
127.8 TOPSINT4 Tensor
Peak OPS
3.11 TFLOPSFP32
Tensor FP16-16
31.95 TFLOPS
Tensor FP16-32
31.95 TFLOPS
-
BF16
63.9 TFLOPS
Tensor BF16
31.95 TFLOPS
-
FP32
31.95 TFLOPS
FP32
3.11 TFLOPS
FP64
998.4 GFLOPS
FP64
97.2 GFLOPS
Tensor INT4
127.8 TOPS
Tensor INT4
-
Tensor INT8
31.95 TOPS
-
Pixel Rate
249.6 GPixel/s
Pixel Rate
58.3 GPixel/s
Texture Rate
499.2 GTexel/s
Texture Rate
97.2 GTexel/s

Shaders
3,072 Shaders
Shaders
1,280 Shaders
TMUs
192 TMUs
TMUs
80 TMUs
ROPs
96 ROPs
ROPs
48 ROPs
Tensor Cores
96 T-Cores
Tensor Cores
-
RT Cores
48 RT-Cores
RT Cores
-
CUs
48 CUs
SMs
10 SMs

Base Clock
1.9GHz
Base Clock
1.09GHz
Boost Clock
2.6GHz
Boost Clock
1.22GHz

L2 Cache
6.1MB shared
L2 Cache
1.5MB shared
L3 Cache
64MB shared
L3 Cache
-
L3 Bandwidth
2.33TB/s
L3 Bandwidth
-

16GB GDDR6
6GB GDDR5
Memory Bus
256-bit
Memory Bus
192-bit
Memory Speed
18GT/s
Memory Speed
7GT/s
Memory Bandwidth
576GB/s
Memory Bandwidth
168GB/s
ECC
No
ECC
No

TDP
190W
TDP
75W

Multi-Monitor
3
Multi-Monitor
3
HDCP
HDCP 2.3
HDCP
-

4x DisplayPort 2.1
-

Encoder Model
VCN 4.0
Encoder Model
NVENC 4

Decoder Model
VCN 4.0
Decoder Model
NVDEC 3

Form Factor
PCIe Card
Form Factor
Soldered
PCIe
2-Slots
PCIe
-
Height
111 mm (4.37")
Width
241 mm (9.49")
Depth
40 mm (1.57")
-
Cooling
Blower
1x Fan
Cooling
Open-Air
-
Power Connectors
1x 8-Pin
Power Connectors
-

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon Pro 2023 branding
Branding
Quadro 2018 branding
Codename
Wheat Nas
Codename
NV136
Chip Variant
Navi 32
Chip Variant
GP106-300-A1
Market Segment
Workstation
Market Segment
Laptop
Release Date
Nov 13, 2023
Release Date
Jan 11, 2017

Foundry
TSMC
Foundry
TSMC
Other Foundries
TSMCMCD
Other Foundries
-
Fabrication Node
N5
N6MCD
Fabrication Node
16FF
-
Die Size
200mm²
150mm²MCD
Die Size
200mm²
-
Transistor Count
28.1 Billion
8.2 BillionMCD
Transistor Count
4.4 Billion
-
Transistor Density
140.5 MTr/mm²
54.67 MTr/mm²MCD
Transistor Density
22 MTr/mm²
-

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