GPUs

AMD Radeon PRO W7900 vs NVIDIA Quadro RTX 3000 Full Specs

6,144 Shaders
2.5GHz
2,304 Shaders
1.38GHz
48GB GDDR6864GB/s
6GB GDDR6448GB/s
··
61.32 TFLOPS
··
6.36 TFLOPS
Form Factor
PCIe Card
Form Factor
Soldered
TDP
295W
TDP
80W
Power Connectors
2x 8-Pin
Power Connectors
-

Radeon PRO W7900Radeon PRO W7900245.3 TOPSINT4 Tensor
x19.29
Quadro RTX 3000Quadro RTX 300012.72 TFLOPSFP16
x1

Clock Speed
··
Clock Speed
···
Peak OPS
245.3 TOPSINT4 Tensor
Peak OPS
12.72 TFLOPSFP16
Tensor FP16-16
61.32 TFLOPS
Tensor FP16-32
61.32 TFLOPS
-
BF16
122.6 TFLOPS
Tensor BF16
61.32 TFLOPS
-
FP32
61.32 TFLOPS
FP32
6.36 TFLOPS
FP64
1.92 TFLOPS
FP64
198.7 GFLOPS
Tensor INT4
245.3 TOPS
Tensor INT4
-
Tensor INT8
61.32 TOPS
-
Pixel Rate
479 GPixel/s
Pixel Rate
66.2 GPixel/s
Texture Rate
958.1 GTexel/s
Texture Rate
198.7 GTexel/s

Shaders
6,144 Shaders
Shaders
2,304 Shaders
TMUs
384 TMUs
TMUs
144 TMUs
ROPs
192 ROPs
ROPs
48 ROPs
Tensor Cores
192 T-Cores
Tensor Cores
288 T-Cores
RT Cores
96 RT-Cores
RT Cores
36 RT-Cores
CUs
96 CUs
SMs
36 SMs

Base Clock
-
Base Clock
945MHz
Boost Clock
2.5GHz
Boost Clock
1.38GHz

L2 Cache
6.1MB shared
L2 Cache
4.1MB shared
L3 Cache
96MB shared
L3 Cache
-
L3 Bandwidth
3.5TB/s
L3 Bandwidth
-

48GB GDDR6
6GB GDDR6
Memory Bus
384-bit
Memory Bus
256-bit
Memory Speed
18GT/s
Memory Speed
14GT/s
Memory Bandwidth
864GB/s
Memory Bandwidth
448GB/s
ECC
No
ECC
No

TDP
295W
TDP
80W

Multi-Monitor
3
Multi-Monitor
4
HDCP
HDCP 2.3
HDCP
HDCP 2.2

3x DisplayPort 2.1
-
1x Mini DisplayPort 2.1
-

Encoder Model
VCN 4.0
Encoder Model
NVENC 7

Decoder Model
VCN 4.0
Decoder Model
NVDEC 4

Form Factor
PCIe Card
Form Factor
Soldered
PCIe
3-Slots
PCIe
-
Height
110 mm (4.33")
Width
280 mm (11.02")
Depth
51 mm (2.01")
-
Cooling
Blower
1x Fan
Cooling
Open-Air
-
Power Connectors
2x 8-Pin
Power Connectors
-

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon Pro 2023 branding
Branding
Quadro RTX branding
Codename
Plum Bonito
Codename
NV166
Chip Variant
Navi 31 XL
Chip Variant
TU106-125-A1
Market Segment
Workstation
Market Segment
Laptop
Release Date
Apr 13, 2023
Release Date
May 27, 2019

Foundry
TSMC
Foundry
TSMC
Other Foundries
TSMCMCD
Other Foundries
-
Fabrication Node
N5
N6MCD
Fabrication Node
12FFN
-
Die Size
304mm²
225mm²MCD
Die Size
445mm²
-
Transistor Count
45.4 Billion
12.3 BillionMCD
Transistor Count
10.8 Billion
-
Transistor Density
149.2 MTr/mm²
54.67 MTr/mm²MCD
Transistor Density
24.27 MTr/mm²
-

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