GPUs

AMD Radeon R2 2CU 300MHz GCN 2 vs AMD Radeon 740M 2500MHz Full Specs

128 Shaders
300MHz
256 Shaders
2.5GHz
Shared Memory25.6GB/s
·
Shared Memory120GB/s
·
··
76.8 GFLOPS
··
1.28 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Radeon R2 2CU 300MHz GCN 2Radeon R2 2CU 300MHz GCN 276.8 GFLOPSFP32
x1
Radeon 740M 2500MHzRadeon 740M 2500MHz2.56 TFLOPSFP16
x33.33

Clock Speed
··
Clock Speed
···
Peak OPS
76.8 GFLOPSFP32
Peak OPS
2.56 TFLOPSFP16
-
BF16
2.56 TFLOPS
FP32
76.8 GFLOPS
FP32
1.28 TFLOPS
FP64
4.8 GFLOPS
FP64
80 GFLOPS
Pixel Rate
1.2 GPixel/s
Pixel Rate
20 GPixel/s
Texture Rate
2.4 GTexel/s
Texture Rate
40 GTexel/s

Shaders
128 Shaders
Shaders
256 Shaders
TMUs
8 TMUs
TMUs
16 TMUs
ROPs
4 ROPs
ROPs
8 ROPs
RT Cores
-
RT Cores
4 RT-Cores
CUs
2 CUs
CUs
4 CUs

Base Clock
-
Base Clock
1.5GHz
Boost Clock
300MHz
Boost Clock
2.5GHz

L2 Cache
64KB shared
L2 Cache
-

Shared Memory
·
Shared Memory
·
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
1.6GT/s
Memory Speed
7.5GT/s
Memory Bandwidth
25.6GB/s
Memory Bandwidth
120GB/s
ECC
No
ECC
No

Multi-Monitor
3
Multi-Monitor
4
HDCP
-
HDCP
HDCP 2.2

Encoder Model
VCE 2.0
Encoder Model
VCN 4.0

Decoder Model
UVD 4.2
Decoder Model
VCN 4.0

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2013 branding
Branding
Radeon 2023 branding
Codename
Kalindi
Codename
Phoenix
Chip Variant
Kalindi LP
Chip Variant
-
Market Segment
Laptop
Market Segment
Laptop
Release Date
Apr 29, 2014
Release Date
May 3, 2023

Foundry
GlobalFoundries
Foundry
TSMC
Fabrication Node
28nm
Fabrication Node
N4
Die Size
107mm²
Die Size
137mm²
Transistor Count
930 Million
Transistor Count
20.9 Billion
Transistor Density
9 MTr/mm²
Transistor Density
153 MTr/mm²

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