GPUs

AMD Radeon R2 2CU 400MHz GCN 2 vs Intel Graphics 4C 2500MHz Full Specs

128 Shaders
400MHz
512 Shaders
2.5GHz
Shared Memory21.3GB/sDDR3L
Shared Memory136.5GB/s
·
··
102.4 GFLOPS
··
2.56 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Radeon R2 2CU 400MHz GCN 2Radeon R2 2CU 400MHz GCN 2102.4 GFLOPSFP32
x1
Graphics 4C 2500MHzGraphics 4C 2500MHz81.92 TOPSINT4 Tensor
x800.00

Clock Speed
··
Clock Speed
··
Peak OPS
102.4 GFLOPSFP32
Peak OPS
81.92 TOPSINT4 Tensor
-
Tensor FP16-32
20.48 TFLOPS
-
Tensor BF16
20.48 TFLOPS
FP32
102.4 GFLOPS
FP32
2.56 TFLOPS
FP64
6.4 GFLOPS
FP64
640 GFLOPS
Tensor INT4
-
Tensor INT4
81.92 TOPS
-
Tensor INT8
40.96 TOPS
Pixel Rate
1.6 GPixel/s
Pixel Rate
40 GPixel/s
Texture Rate
3.2 GTexel/s
Texture Rate
80 GTexel/s

Shaders
128 Shaders
Shaders
512 Shaders
TMUs
8 TMUs
TMUs
32 TMUs
ROPs
4 ROPs
ROPs
16 ROPs
Tensor Cores
-
Tensor Cores
32 T-Cores
RT Cores
-
RT Cores
4 RT-Cores
CUs
2 CUs
EUs
32 EUs

Boost Clock
400MHz
Boost Clock
2.5GHz

L2 Cache
64KB shared
L2 Cache
4.1MB shared

Shared MemoryDDR3L
Shared Memory
·
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
1.3GT/s
Memory Speed
8.5GT/s
Memory Bandwidth
21.3GB/s
Memory Bandwidth
136.5GB/s

Multi-Monitor
3
Multi-Monitor
3

Encoder Model
VCE 2.0
Encoder Model
Xe Media Engine

Decoder Model
UVD 4.2
Decoder Model
Xe Media Engine

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2013 branding
Branding
Graphics 2024 branding
Codename
Kalindi
Codename
Xe3 LPG
Chip Variant
Kalindi LP
Chip Variant
GT1
Market Segment
Laptop
Market Segment
Laptop
Release Date
May 1, 2015
Release Date
Jan 5, 2026

Foundry
GlobalFoundries
Foundry
Intel
Fabrication Node
28nm
Fabrication Node
Intel 3
Die Size
107mm²
Die Size
27mm²
Transistor Count
930 Million
Transistor Count
-
Transistor Density
9 MTr/mm²
Transistor Density
-

No images available
No images available