GPUs

AMD Radeon R2E 2CU 300MHz GCN 2 vs Intel Graphics 80EU 1250MHz Full Specs

128 Shaders
300MHz
640 Shaders
1.25GHz
Shared Memory21.3GB/sDDR3
Shared Memory102.4GB/s
···
··
76.8 GFLOPS
··
1.6 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Radeon R2E 2CU 300MHz GCN 2Radeon R2E 2CU 300MHz GCN 276.8 GFLOPSFP32
x1
Graphics 80EU 1250MHzGraphics 80EU 1250MHz3.2 TFLOPSFP16
x41.67

Clock Speed
··
Clock Speed
··
Peak OPS
76.8 GFLOPSFP32
Peak OPS
3.2 TFLOPSFP16
FP32
76.8 GFLOPS
FP32
1.6 TFLOPS
FP64
4.8 GFLOPS
FP64
400 GFLOPS
Pixel Rate
1.2 GPixel/s
Pixel Rate
25 GPixel/s
Texture Rate
2.4 GTexel/s
Texture Rate
50 GTexel/s

Shaders
128 Shaders
Shaders
640 Shaders
TMUs
8 TMUs
TMUs
40 TMUs
ROPs
4 ROPs
ROPs
20 ROPs
CUs
2 CUs
EUs
80 EUs

Boost Clock
300MHz
Boost Clock
1.25GHz

L2 Cache
64KB shared
L2 Cache
896KB shared
L3 Cache
-
L3 Cache
3MB shared

Shared MemoryDDR3
Shared Memory
···
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
1.3GT/s
Memory Speed
6.4GT/s
Memory Bandwidth
21.3GB/s
Memory Bandwidth
102.4GB/s
ECC
No
ECC
No

Multi-Monitor
3
Multi-Monitor
4

Encoder Model
VCE 2.0
Encoder Model
Quick Sync Video 8

Decoder Model
UVD 4.2
Decoder Model
Quick Sync Video 8

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2013 branding
Branding
Iris Xe branding
Codename
Kalindi
Codename
Xe LP
Chip Variant
Kalindi LP
Chip Variant
GT1
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jun 4, 2014
Release Date
Jan 8, 2024

Foundry
GlobalFoundries
Foundry
Intel
Fabrication Node
28nm
Fabrication Node
Intel 7
Die Size
107mm²
Die Size
161mm²
Transistor Count
930 Million
Transistor Count
11.9 Billion
Transistor Density
9 MTr/mm²
Transistor Density
74 MTr/mm²

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