AMD Radeon R7 370 vs AMD Radeon R9 390X Full Specs

Summary

1,024 Shaders 975MHz	2,816 Shaders 1.05GHz
2GB GDDR5179.2GB/s	8GB GDDR5384GB/s
Peak·FP32·FP16 2 TFLOPS	Peak·FP32·FP16 5.91 TFLOPS
Form Factor PCIe Card	Form Factor PCIe Card
TDP 110W	TDP 275W
Power Connectors - 1x 6-Pin	Power Connectors 1x 8-Pin 1x 6-Pin

Highlights

Peak OPS

Peak OPS FP32 FP64 Memory Bandwidth TDP

Radeon R7 3702 TFLOPSFP32

x1

Radeon R9 390X5.91 TFLOPSFP32

x2.96

Show Top Score

Theoretical Performance

Clock Speed975MHz UC·Boost·OC	Clock Speed1050MHz UC·Boost·OC
Peak OPS 2 TFLOPSFP32	Peak OPS 5.91 TFLOPSFP32
FP32 2 TFLOPS	FP32 5.91 TFLOPS
FP64 124.8 GFLOPS	FP64 739.2 GFLOPS
Pixel Rate 31.2 GPixel/s	Pixel Rate 67.2 GPixel/s
Texture Rate 62.4 GTexel/s	Texture Rate 184.8 GTexel/s

Core Config

Shaders 1,024 Shaders	Shaders 2,816 Shaders
TMUs 64 TMUs	TMUs 176 TMUs
ROPs 32 ROPs	ROPs 64 ROPs
CUs 16 CUs	CUs 44 CUs

Clocks

Boost Clock 975MHz

Boost Clock 1.05GHz

Cache

L2 Cache 512KB shared

L2 Cache 1MB shared

Memory

2GB GDDR5	8GB GDDR5
Memory Bus 256-bit	Memory Bus 512-bit
Memory Speed 5.6GT/s	Memory Speed 6GT/s
Memory Bandwidth 179.2GB/s	Memory Bandwidth 384GB/s

Power & Thermals

TDP 110W

TDP 275W

Video Output

Multi-Monitor 3	Multi-Monitor 3
HDCP -	HDCP HDCP 1.4

Ports

1x DisplayPort 1.2	1x DisplayPort 1.2
1x HDMI 1.4	1x HDMI 1.4
1x DVI-D Dual-Link	2x DVI-D Dual-Link
1x DVI-I Dual-Link	-

Encoder

Encoder Model VCE 1.0

Encoder Model VCE 2.0

Decoder

Decoder Model UVD 4.0

Decoder Model UVD 4.2

Card

Form Factor PCIe Card	Form Factor PCIe Card
PCIe 2-Slots	PCIe 2-Slots
Height 111 mm (4.37") Width 221 mm (8.7") Depth 37 mm (1.46")	Height 110 mm (4.33") Width 275 mm (10.83") Depth 36 mm (1.42")
Cooling Open-Air 1x Fan	Cooling Blower 1x Fan
Power Connectors 1x 6-Pin	Power Connectors 1x 8-Pin, 1x 6-Pin

Chip

Manufacturer AMD	Manufacturer AMD
Chip Designer AMD	Chip Designer AMD
Architecture GCN 1	Architecture GCN 2
Family Radeon R 300	Family Radeon R 300
Branding	Branding
Codename Pitcairn	Codename Hawaii
Chip Variant Pitcairn Pro	Chip Variant Hawaii Pro
Market Segment Desktop	Market Segment Desktop
Release Date Jun 18, 2015	Release Date Jun 18, 2015

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node 28nm	Fabrication Node 28nm
Die Size 212mm²	Die Size 438mm²
Transistor Count 2.8 Billion	Transistor Count 6.2 Billion
Transistor Density 13.21 MTr/mm²	Transistor Density 14.16 MTr/mm²

Images

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Competitors

AMDRadeon R7 370 vs GPU MSIGeForce RTX 3050 LP 6G OC AMDRadeon R7 370 vs GPU NVIDIAGeForce RTX 3050 6GB AMDRadeon R7 370 vs GPU GIGABYTEGeForce RTX 3050 OC Low Profile 6G Show 11 more

AMDRadeon R9 390X vs GPU AMDRadeon RX 7700 XT AMDRadeon R9 390X vs GPU NVIDIAGeForce RTX 4060 AMDRadeon R9 390X vs GPU NVIDIAGeForce RTX 4060 Ti Show 12 more