GPUs

AMD Radeon R9 270 vs AMD Radeon RX 7400 Full Specs

1,280 Shaders
925MHz
1,792 Shaders
1.1GHz
2GB GDDR5179.2GB/s
8GB GDDR6172.8GB/s
··
2.37 TFLOPS
··
7.88 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
150W
TDP
55W
Power Connectors
-
1x 6-Pin
Power Connectors
1x 8-Pin
-

Radeon R9 270Radeon R9 2702.37 TFLOPSFP32
x1
Radeon RX 7400Radeon RX 740031.54 TOPSINT4 Tensor
x13.32

Clock Speed
···
Clock Speed
···
Peak OPS
2.37 TFLOPSFP32
Peak OPS
31.54 TOPSINT4 Tensor
-
Tensor FP16-16
7.88 TFLOPS
Tensor FP16-32
7.88 TFLOPS
-
BF16
15.77 TFLOPS
Tensor BF16
7.88 TFLOPS
FP32
2.37 TFLOPS
FP32
7.88 TFLOPS
FP64
148 GFLOPS
FP64
246.4 GFLOPS
Tensor INT4
-
Tensor INT4
31.54 TOPS
-
Tensor INT8
7.88 TOPS
Pixel Rate
29.6 GPixel/s
Pixel Rate
70.4 GPixel/s
Texture Rate
74 GTexel/s
Texture Rate
123.2 GTexel/s

Shaders
1,280 Shaders
Shaders
1,792 Shaders
TMUs
80 TMUs
TMUs
112 TMUs
ROPs
32 ROPs
ROPs
64 ROPs
Tensor Cores
-
Tensor Cores
56 T-Cores
RT Cores
-
RT Cores
28 RT-Cores
CUs
20 CUs
CUs
28 CUs

Base Clock
900MHz
Base Clock
1GHz
Boost Clock
925MHz
Boost Clock
1.1GHz

L2 Cache
512KB shared
L2 Cache
2MB shared
L3 Cache
-
L3 Cache
32MB shared
L3 Bandwidth
-
L3 Bandwidth
1.16TB/s

2GB GDDR5
8GB GDDR6
Memory Bus
256-bit
Memory Bus
128-bit
Memory Speed
5.6GT/s
Memory Speed
10.8GT/s
Memory Bandwidth
179.2GB/s
Memory Bandwidth
172.8GB/s
ECC
No
ECC
No

TDP
150W
TDP
55W

Multi-Monitor
3
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

-
3x DisplayPort 2.1
1x DisplayPort 1.2
-
-
1x HDMI 2.1
1x HDMI 1.4
-
1x DVI-D Dual-Link
-
1x DVI-I Dual-Link
-

Encoder Model
VCE 1.0
Encoder Model
VCN 4.0

Decoder Model
UVD 3.2
Decoder Model
VCN 4.0

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
2-Slots
PCIe
2-Slots
-
Height
115 mm (4.53")
Width
204 mm (8.03")
Depth
40 mm (1.57")
Cooling
Open-Air
1x Fan
Cooling
Open-Air
2x Fans
Power Connectors
1x 6-Pin
Power Connectors
1x 8-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2013 branding
Branding
Radeon 2023 branding
Codename
Pitcairn
Codename
Hotpink Bonefish
Chip Variant
Pitcairn Pro
Chip Variant
Navi 33 XL
Market Segment
Desktop
Market Segment
Desktop
Release Date
Nov 13, 2013
Release Date
Aug 8, 2025

Foundry
TSMC
Foundry
TSMC
Fabrication Node
28nm
Fabrication Node
N6
Die Size
212mm²
Die Size
204mm²
Transistor Count
2.8 Billion
Transistor Count
13.3 Billion
Transistor Density
13.21 MTr/mm²
Transistor Density
65.2 MTr/mm²

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