GPUs

AMD Radeon R9 295X2 vs MSI GeForce RTX 3050 LP 6G OC Full Specs

5,632 Shaders
1.02GHz
2,304 Shaders
1.49GHz
8GB GDDR5640GB/s
6GB GDDR6168GB/s
··
11.47 TFLOPS
··
6.88 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
500W
TDP
70W
Power Connectors
2x 8-Pin
Power Connectors
-

Radeon R9 295X2Radeon R9 295X211.47 TFLOPSFP32 (2x 5.73 TFLOPS)
x1
GeForce RTX 3050 LP 6G OCGeForce RTX 3050 LP 6G OC220 TOPSINT4 Tensor Sparse
x19.19

Clock Speed
··
Clock Speed
···
Peak OPS
11.47 TFLOPSFP32
Peak OPS
220 TOPSINT4 Tensor Sparse
-
Tensor FP16-16
27.5 TFLOPS
FP16-16 Tensor Sparse
55 TFLOPS
Tensor FP16-32
13.75 TFLOPS
FP16-32 Tensor Sparse
27.5 TFLOPS
-
BF16
6.88 TFLOPS
Tensor BF16
13.75 TFLOPS
BF16 Tensor Sparse
27.5 TFLOPS
Tensor TF32
-
Tensor TF32
6.88 TFLOPS
FP32
11.47 TFLOPS
FP32
6.88 TFLOPS
FP64
1.43 TFLOPS
FP64
107.4 GFLOPS
Tensor INT4
-
Tensor INT4
110 TOPS
-
Tensor INT8
55 TOPS
Ray
-
Ray
10.37 TOPS
Pixel Rate
65.2 GPixel/s
Pixel Rate
47.7 GPixel/s
Texture Rate
179.2 GTexel/s
Texture Rate
107.4 GTexel/s

Shaders
5,632 Shaders
Shaders
2,304 Shaders
TMUs
352 TMUs
TMUs
72 TMUs
ROPs
128 ROPs
ROPs
32 ROPs
Tensor Cores
-
Tensor Cores
72 T-Cores
RT Cores
-
RT Cores
18 RT-Cores
CUs
88 CUs
SMs
18 SMs

Base Clock
-
Base Clock
1.04GHz
Boost Clock
1.02GHz
Boost Clock
1.49GHz

L2 Cache
1MB shared
L2 Cache
2MB shared

8GB GDDR5
6GB GDDR6
Memory Bus
512-bit
Memory Bus
96-bit
Memory Speed
5GT/s
Memory Speed
14GT/s
Memory Bandwidth
640GB/s
Memory Bandwidth
168GB/s
ECC
No
ECC
No

TDP
500W
TDP
70W

Multi-Monitor
4
Multi-Monitor
3
HDCP
HDCP 1.4
HDCP
HDCP 2.3

-
1x DisplayPort 1.4
4x Mini DisplayPort 1.2
-
-
2x HDMI 2.1
1x DVI-D Dual-Link
-

Encoder Model
VCE 2.0
Encoder Model
NVENC 7

Decoder Model
UVD 4.2
Decoder Model
NVDEC 5

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
2.1-Slots
PCIe
2-Slots
Height
115 mm (4.53")
Width
307 mm (12.09")
Depth
42 mm (1.65")
Height
69 mm (2.72")
Width
174 mm (6.85")
Depth
40 mm (1.57")
Cooling
Liquid 120mm Radiator
1x Fan
Cooling
Open-Air
2x Fans
Power Connectors
2x 8-Pin
Power Connectors
-

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2013 branding
Branding
GeForce RTX 2018 branding
Codename
Hawaii
Codename
NV177
Chip Variant
Hawaii Pro
Chip Variant
GA107-140-A1
Market Segment
Desktop
Market Segment
Desktop
Release Date
Apr 8, 2014
Release Date
Feb 2, 2024

Foundry
TSMC
Foundry
Samsung
Fabrication Node
28nm
Fabrication Node
8N
Die Size
438mm²
Die Size
200mm²
Transistor Count
6.2 Billion
Transistor Count
8.7 Billion
Transistor Density
14.16 MTr/mm²
Transistor Density
43.5 MTr/mm²

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