GPUs

AMD Radeon RX 6600S vs NVIDIA GeForce RTX 3050 Ti Laptop 80W Full Specs

1,792 Shaders
2GHz
2,560 Shaders
1.7GHz
4GB GDDR6224GB/s
4GB GDDR6192GB/s
··
7.17 TFLOPS
··
8.68 TFLOPS
Form Factor
Soldered
Form Factor
Soldered
TDP
80W
TDP
80W

Clock Speed
···
Clock Speed
···
Peak OPS
14.34 TFLOPSFP16
Peak OPS
277.7 TOPSINT4 Tensor Sparse
-
Tensor FP16-16
34.71 TFLOPS
FP16-16 Tensor Sparse
69.43 TFLOPS
Tensor FP16-32
17.36 TFLOPS
FP16-32 Tensor Sparse
34.71 TFLOPS
-
BF16
8.68 TFLOPS
Tensor BF16
17.36 TFLOPS
BF16 Tensor Sparse
34.71 TFLOPS
Tensor TF32
-
Tensor TF32
8.68 TFLOPS
FP32
7.17 TFLOPS
FP32
8.68 TFLOPS
FP64
448 GFLOPS
FP64
135.6 GFLOPS
Tensor INT4
-
Tensor INT4
138.9 TOPS
-
Tensor INT8
69.43 TOPS
Ray
-
Ray
13.09 TOPS
Pixel Rate
128 GPixel/s
Pixel Rate
54.2 GPixel/s
Texture Rate
256 GTexel/s
Texture Rate
135.6 GTexel/s

Shaders
1,792 Shaders
Shaders
2,560 Shaders
TMUs
128 TMUs
TMUs
80 TMUs
ROPs
64 ROPs
ROPs
32 ROPs
Tensor Cores
-
Tensor Cores
80 T-Cores
RT Cores
28 RT-Cores
RT Cores
20 RT-Cores
CUs
28 CUs
SMs
20 SMs

Base Clock
1.7GHz
Base Clock
1.46GHz
Boost Clock
2GHz
Boost Clock
1.7GHz

L2 Cache
2MB shared
L2 Cache
2MB shared
L3 Cache
32MB shared
L3 Cache
-
L3 Bandwidth
832GB/s
L3 Bandwidth
-

4GB GDDR6
4GB GDDR6
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
14GT/s
Memory Speed
12GT/s
Memory Bandwidth
224GB/s
Memory Bandwidth
192GB/s
ECC
No
ECC
No

TDP
80W
TDP
80W

Multi-Monitor
4
Multi-Monitor
3
HDCP
HDCP 2.3
HDCP
HDCP 2.3

Encoder Model
VCN 3.0
Encoder Model
NVENC 7
Codec
AVC (H.264)
HEVC (H.265)
Codec
AVC (H.264)
HEVC (H.265)

Decoder Model
VCN 3.0
Decoder Model
NVDEC 5
Codec
MPEG-1
MPEG-2
MPEG-4
JPEG
VC-1
-
VP9
AVC (H.264)
HEVC (H.265)
AV1
Codec
MPEG-1
MPEG-2
MPEG-4
-
VC-1
VP8
VP9
AVC (H.264)
HEVC (H.265)
AV1

Form Factor
Soldered
Form Factor
Soldered
Cooling
Passive
Cooling
Open-Air

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2020 branding
Branding
GeForce RTX 2018 branding
Codename
Dimgrey Cavefish
Codename
NV177
Chip Variant
Navi 23 XL
Chip Variant
GA107-140-A1
Market Segment
Desktop
Market Segment
Laptop
Release Date
Jan 4, 2022
Release Date
May 11, 2021

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N7
Fabrication Node
8N
Die Size
237mm²
Die Size
200mm²
Transistor Count
11.1 Billion
Transistor Count
8.7 Billion
Transistor Density
46.67 MTr/mm²
Transistor Density
43.5 MTr/mm²