AMD Radeon RX 7400 vs Intel Arc Pro B50 Full Specs
1,792 Shaders 1.1GHz | 2,048 Shaders 2.6GHz |
8GB GDDR6172.8GB/s | 16GB GDDR6224GB/s |
·· 7.88 TFLOPS | ·· 10.65 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 55W | TDP 70W |
Power Connectors 1x 8-Pin | Power Connectors 1x 8-Pin |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 31.54 TOPSINT4 Tensor | Peak OPS 340.8 TOPSINT4 Tensor |
Tensor FP16-16 7.88 TFLOPSTensor FP16-32 7.88 TFLOPS | Tensor FP16-16 -Tensor FP16-32 85.2 TFLOPS |
BF16 15.77 TFLOPSTensor BF16 7.88 TFLOPS | BF16 -Tensor BF16 85.2 TFLOPS |
FP32 7.88 TFLOPS | FP32 10.65 TFLOPS |
FP64 246.4 GFLOPS | FP64 2.66 TFLOPS |
Tensor INT4 31.54 TOPS | Tensor INT4 340.8 TOPS |
Tensor INT8 7.88 TOPS | Tensor INT8 170.4 TOPS |
Pixel Rate 70.4 GPixel/s | Pixel Rate 166.4 GPixel/s |
Texture Rate 123.2 GTexel/s | Texture Rate 332.8 GTexel/s |
Shaders 1,792 Shaders | Shaders 2,048 Shaders |
TMUs 112 TMUs | TMUs 128 TMUs |
ROPs 64 ROPs | ROPs 64 ROPs |
Tensor Cores 56 T-Cores | Tensor Cores 128 T-Cores |
RT Cores 28 RT-Cores | RT Cores 16 RT-Cores |
CUs 28 CUs | EUs 128 EUs |
Base Clock 1GHz | Base Clock 2GHz |
Boost Clock 1.1GHz | Boost Clock 2.6GHz |
L2 Cache 2MB shared | L2 Cache 18.4MB shared |
L3 Cache 32MB shared | L3 Cache - |
L3 Bandwidth 1.16TB/s | L3 Bandwidth - |
8GB GDDR6 | 16GB GDDR6 |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 10.8GT/s | Memory Speed 14GT/s |
Memory Bandwidth 172.8GB/s | Memory Bandwidth 224GB/s |
TDP 55W | TDP 70W |
Multi-Monitor 3 | Multi-Monitor 4 |
HDCP HDCP 2.3 | HDCP - |
3x DisplayPort 2.1 | - |
- | 4x Mini DisplayPort 2.1 |
1x HDMI 2.1 | - |
Encoder Model VCN 4.0 | Encoder Model Arc |
Decoder Model VCN 4.0 | Decoder Model Arc |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2-Slots |
Height 115 mm (4.53")Width 204 mm (8.03")Depth 40 mm (1.57") | Height 69 mm (2.72")Width 168 mm (6.61")Depth 40 mm (1.57") |
Cooling Open-Air 2x Fans | Cooling Blower 1x Fan |
Power Connectors 1x 8-Pin | Power Connectors 1x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Hotpink Bonefish | Codename Xe2 HPG |
Chip Variant Navi 33 XL | Chip Variant - |
Market Segment Desktop | Market Segment Workstation |
Release Date Aug 8, 2025 | Release Date May 19, 2025 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node N5 |
Die Size 204mm² | Die Size 272mm² |
Transistor Count 13.3 Billion | Transistor Count 19.6 Billion |
Transistor Density 65.2 MTr/mm² | Transistor Density 72.06 MTr/mm² |
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