AMD Radeon RX 7600 vs NVIDIA GeForce GTX 560 Ti 11SM Full Specs
2,048 Shaders 2.25GHz | 352 Shaders 732MHz |
8GB GDDR6288GB/s | 1GB GDDR5152GB/s |
·· 18.43 TFLOPS | ·· 1.03 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 165W | TDP 210W |
Power Connectors 1x 8-Pin - | Power Connectors - 2x 6-Pin |
Radeon RX 760073.73 TOPSINT4 Tensor
GeForce GTX 560 Ti 11SM1.03 TFLOPSFP32Clock Speed ··· | Clock Speed ·· |
Peak OPS 73.73 TOPSINT4 Tensor | Peak OPS 1.03 TFLOPSFP32 |
Tensor FP16-16 18.43 TFLOPSTensor FP16-32 18.43 TFLOPS | - |
BF16 36.86 TFLOPSTensor BF16 18.43 TFLOPS | - |
FP32 18.43 TFLOPS | FP32 1.03 TFLOPS |
FP64 576 GFLOPS | FP64 128.8 GFLOPS |
Tensor INT4 73.73 TOPS | Tensor INT4 - |
Tensor INT8 18.43 TOPS | - |
Pixel Rate 144 GPixel/s | Pixel Rate 58.6 GPixel/s |
Texture Rate 288 GTexel/s | Texture Rate 64.4 GTexel/s |
Shaders 2,048 Shaders | Shaders 352 Shaders |
TMUs 128 TMUs | TMUs 44 TMUs |
ROPs 64 ROPs | ROPs 40 ROPs |
Tensor Cores 64 T-Cores | Tensor Cores - |
RT Cores 32 RT-Cores | RT Cores - |
CUs 32 CUs | SMs 11 SMs |
Base Clock 1.72GHz | Base Clock - |
Boost Clock 2.25GHz | Boost Clock 732MHz |
Shader Clock - | Shader Clock 1.46GHz |
L2 Cache 2MB shared | L2 Cache 768KB shared |
L3 Cache 32MB shared | L3 Cache - |
L3 Bandwidth 1.16TB/s | L3 Bandwidth - |
8GB GDDR6 | 1GB GDDR5 |
Memory Bus 128-bit | Memory Bus 320-bit |
Memory Speed 18GT/s | Memory Speed 3.8GT/s |
Memory Bandwidth 288GB/s | Memory Bandwidth 152GB/s |
ECC No | ECC No |
TDP 165W | TDP 210W |
Multi-Monitor 3 | Multi-Monitor 2 |
HDCP HDCP 2.3 | HDCP - |
3x DisplayPort 2.1 | - |
1x HDMI 2.1 | - |
- | 1x Mini HDMI 1.3 |
- | 2x DVI-I Dual-Link |
Encoder Model VCN 4.0 | - |
Decoder Model VCN 4.0 | Decoder Model VP4 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2-Slots |
Height 115 mm (4.53")Width 204 mm (8.03")Depth 40 mm (1.57") | Height 111 mm (4.37")Width 229 mm (9.02")Depth 38 mm (1.5") |
Cooling Open-Air 2x Fans | Cooling Open-Air 1x Fan |
Power Connectors 1x 8-Pin | Power Connectors 2x 6-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Hotpink Bonefish | Codename NVC8 |
Chip Variant Navi 33 XL | Chip Variant - |
Market Segment Desktop | Market Segment Desktop |
Release Date May 25, 2023 | Release Date May 30, 2011 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node 40nm |
Die Size 204mm² | Die Size 520mm² |
Transistor Count 13.3 Billion | Transistor Count 3 Billion |
Transistor Density 65.2 MTr/mm² | Transistor Density 5.77 MTr/mm² |
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