AMD Radeon RX 7600M vs NVIDIA Quadro P3200 Laptop Full Specs

Summary

1,792 Shaders 2.41GHz	1,792 Shaders 1.54GHz
8GB GDDR6256GB/s	6GB GDDR5168GB/s
Peak·FP32·FP16 17.27 TFLOPS	Peak·FP32·FP16 5.53 TFLOPS
Form Factor Soldered	Form Factor Soldered
TDP 90W	TDP 78W

Theoretical Performance

Clock Speed2410MHz UC·Base·Boost·OC	Clock Speed1543MHz UC·Base·Boost·OC
Peak OPS 69.1 TOPSINT4 Tensor	Peak OPS 5.53 TFLOPSFP32
Tensor FP16-16 17.27 TFLOPS Tensor FP16-32 17.27 TFLOPS	-
BF16 34.55 TFLOPS Tensor BF16 17.27 TFLOPS	-
FP32 17.27 TFLOPS	FP32 5.53 TFLOPS
FP64 539.8 GFLOPS	FP64 172.8 GFLOPS
Tensor INT4 69.1 TOPS	Tensor INT4 -
Tensor INT8 17.27 TOPS	-
Pixel Rate 154.2 GPixel/s	Pixel Rate 98.8 GPixel/s
Texture Rate 269.9 GTexel/s	Texture Rate 172.8 GTexel/s

Core Config

Shaders 1,792 Shaders	Shaders 1,792 Shaders
TMUs 112 TMUs	TMUs 112 TMUs
ROPs 64 ROPs	ROPs 64 ROPs
Tensor Cores 56 T-Cores	Tensor Cores -
RT Cores 28 RT-Cores	RT Cores -
CUs 28 CUs	SMs 14 SMs

Clocks

Base Clock 1.5GHz	Base Clock 1.33GHz
Boost Clock 2.41GHz	Boost Clock 1.54GHz

Cache

L2 Cache 2MB shared	L2 Cache 2MB shared
L3 Cache 32MB shared	L3 Cache -
L3 Bandwidth 1.16TB/s	L3 Bandwidth -

Memory

8GB GDDR6	6GB GDDR5
Memory Bus 128-bit	Memory Bus 192-bit
Memory Speed 16GT/s	Memory Speed 7GT/s
Memory Bandwidth 256GB/s	Memory Bandwidth 168GB/s
ECC No	ECC No

Power & Thermals

TDP 90W

TDP 78W

Video Output

Multi-Monitor 3	Multi-Monitor 3
HDCP HDCP 2.3	HDCP -

Encoder

Encoder Model VCN 4.0	Encoder Model 2x NVENC 4
Codec VP9 AVC (H.264) HEVC (H.265) AV1	Codec - AVC (H.264) HEVC (H.265) -

Decoder

Decoder Model VCN 4.0	Decoder Model NVDEC 3
Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 VP9 AVC (H.264) HEVC (H.265) AV1	Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP9 AVC (H.264) HEVC (H.265) -

Card

Form Factor Soldered

Form Factor Soldered

Chip

Manufacturer AMD	Manufacturer NVIDIA
Chip Designer AMD	Chip Designer NVIDIA
Architecture RDNA 3	Architecture Pascal
Family Radeon RX 7000	Family Quadro P
Branding	Branding
Codename Hotpink Bonefish	Codename NV134
Chip Variant Navi 33 XL	Chip Variant GP104-140-A1
Market Segment Laptop	Market Segment Laptop
Release Date Jan 4, 2023	Release Date Feb 21, 2018

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N6	Fabrication Node 16FF
Die Size 204mm²	Die Size 314mm²
Transistor Count 13.3 Billion	Transistor Count 7.2 Billion
Transistor Density 65.2 MTr/mm²	Transistor Density 22.93 MTr/mm²

Images