AMD Radeon RX 7600S vs MSI GeForce RTX 3050 LP 6G OC Full Specs
1,792 Shaders 2.2GHz | 2,304 Shaders 1.49GHz |
8GB GDDR6256GB/s | 6GB GDDR6168GB/s |
·· 15.77 TFLOPS | ·· 6.88 TFLOPS |
Form Factor Soldered | Form Factor PCIe Card |
TDP 75W | TDP 70W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 63.08 TOPSINT4 Tensor | Peak OPS 220 TOPSINT4 Tensor Sparse |
Tensor FP16-16 15.77 TFLOPSFP16-16 Tensor Sparse -Tensor FP16-32 15.77 TFLOPSFP16-32 Tensor Sparse - | Tensor FP16-16 27.5 TFLOPSFP16-16 Tensor Sparse 55 TFLOPSTensor FP16-32 13.75 TFLOPSFP16-32 Tensor Sparse 27.5 TFLOPS |
BF16 31.54 TFLOPSTensor BF16 15.77 TFLOPSBF16 Tensor Sparse - | BF16 6.88 TFLOPSTensor BF16 13.75 TFLOPSBF16 Tensor Sparse 27.5 TFLOPS |
Tensor TF32 - | Tensor TF32 6.88 TFLOPS |
FP32 15.77 TFLOPS | FP32 6.88 TFLOPS |
FP64 492.8 GFLOPS | FP64 107.4 GFLOPS |
Tensor INT4 63.08 TOPS | Tensor INT4 110 TOPS |
Tensor INT8 15.77 TOPS | Tensor INT8 55 TOPS |
Ray - | Ray 10.37 TOPS |
Pixel Rate 140.8 GPixel/s | Pixel Rate 47.7 GPixel/s |
Texture Rate 246.4 GTexel/s | Texture Rate 107.4 GTexel/s |
Shaders 1,792 Shaders | Shaders 2,304 Shaders |
TMUs 112 TMUs | TMUs 72 TMUs |
ROPs 64 ROPs | ROPs 32 ROPs |
Tensor Cores 56 T-Cores | Tensor Cores 72 T-Cores |
RT Cores 28 RT-Cores | RT Cores 18 RT-Cores |
CUs 28 CUs | SMs 18 SMs |
Base Clock 1.5GHz | Base Clock 1.04GHz |
Boost Clock 2.2GHz | Boost Clock 1.49GHz |
L2 Cache 2MB shared | L2 Cache 2MB shared |
L3 Cache 32MB shared | L3 Cache - |
L3 Bandwidth 1.16TB/s | L3 Bandwidth - |
8GB GDDR6 | 6GB GDDR6 |
Memory Bus 128-bit | Memory Bus 96-bit |
Memory Speed 16GT/s | Memory Speed 14GT/s |
Memory Bandwidth 256GB/s | Memory Bandwidth 168GB/s |
TDP 75W | TDP 70W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 2.3 | HDCP HDCP 2.3 |
- | 1x DisplayPort 1.4 |
- | 2x HDMI 2.1 |
Encoder Model VCN 4.0 | Encoder Model NVENC 7 |
Decoder Model VCN 4.0 | Decoder Model NVDEC 5 |
Form Factor Soldered | Form Factor PCIe Card |
PCIe - | PCIe 2-Slots |
- | Height 69 mm (2.72")Width 174 mm (6.85")Depth 40 mm (1.57") |
Cooling Open-Air - | Cooling Open-Air 2x Fans |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Hotpink Bonefish | Codename NV177 |
Chip Variant Navi 33 XL | Chip Variant GA107-140-A1 |
Market Segment Laptop | Market Segment Desktop |
Release Date Jan 4, 2023 | Release Date Feb 2, 2024 |
Foundry TSMC | Foundry Samsung |
Fabrication Node N6 | Fabrication Node 8N |
Die Size 204mm² | Die Size 200mm² |
Transistor Count 13.3 Billion | Transistor Count 8.7 Billion |
Transistor Density 65.2 MTr/mm² | Transistor Density 43.5 MTr/mm² |
No images available
No images available



