AMD Radeon RX 7600S vs NVIDIA Quadro P5000 Laptop Full Specs

Summary

1,792 Shaders 2.2GHz	2,048 Shaders 1.51GHz
8GB GDDR6256GB/s	16GB GDDR5192GB/s
Peak·FP32·FP16 15.77 TFLOPS	Peak·FP32·FP16 6.17 TFLOPS
Form Factor Soldered	Form Factor Soldered
TDP 75W	TDP 100W

Theoretical Performance

Clock Speed2200MHz UC·Base·Boost·OC	Clock Speed1506MHz UC·Base·Boost·OC
Peak OPS 63.08 TOPSINT4 Tensor	Peak OPS 6.17 TFLOPSFP32
Tensor FP16-16 15.77 TFLOPS Tensor FP16-32 15.77 TFLOPS	-
BF16 31.54 TFLOPS Tensor BF16 15.77 TFLOPS	-
FP32 15.77 TFLOPS	FP32 6.17 TFLOPS
FP64 492.8 GFLOPS	FP64 192.8 GFLOPS
Tensor INT4 63.08 TOPS	Tensor INT4 -
Tensor INT8 15.77 TOPS	-
Pixel Rate 140.8 GPixel/s	Pixel Rate 96.4 GPixel/s
Texture Rate 246.4 GTexel/s	Texture Rate 192.8 GTexel/s

Core Config

Shaders 1,792 Shaders	Shaders 2,048 Shaders
TMUs 112 TMUs	TMUs 128 TMUs
ROPs 64 ROPs	ROPs 64 ROPs
Tensor Cores 56 T-Cores	Tensor Cores -
RT Cores 28 RT-Cores	RT Cores -
CUs 28 CUs	SMs 16 SMs

Clocks

Base Clock 1.5GHz	Base Clock 1.16GHz
Boost Clock 2.2GHz	Boost Clock 1.51GHz

Cache

L2 Cache 2MB shared	L2 Cache 2MB shared
L3 Cache 32MB shared	L3 Cache -
L3 Bandwidth 1.16TB/s	L3 Bandwidth -

Memory

8GB GDDR6	16GB GDDR5
Memory Bus 128-bit	Memory Bus 256-bit
Memory Speed 16GT/s	Memory Speed 6GT/s
Memory Bandwidth 256GB/s	Memory Bandwidth 192GB/s
ECC No	ECC No

Power & Thermals

TDP 75W

TDP 100W

Video Output

Multi-Monitor 3	Multi-Monitor 3
HDCP HDCP 2.3	HDCP -

Encoder

Encoder Model VCN 4.0	Encoder Model 2x NVENC 4
Codec VP9 AVC (H.264) HEVC (H.265) AV1	Codec - AVC (H.264) HEVC (H.265) -

Decoder

Decoder Model VCN 4.0	Decoder Model NVDEC 3
Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 VP9 AVC (H.264) HEVC (H.265) AV1	Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP9 AVC (H.264) HEVC (H.265) -

Card

Form Factor Soldered

Form Factor Soldered

Chip

Manufacturer AMD	Manufacturer NVIDIA
Chip Designer AMD	Chip Designer NVIDIA
Architecture RDNA 3	Architecture Pascal
Family Radeon RX 7000	Family Quadro P
Branding	Branding
Codename Hotpink Bonefish	Codename NV134
Chip Variant Navi 33 XL	Chip Variant GP104-140-A1
Market Segment Laptop	Market Segment Laptop
Release Date Jan 4, 2023	Release Date Jan 11, 2017

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N6	Fabrication Node 16FF
Die Size 204mm²	Die Size 314mm²
Transistor Count 13.3 Billion	Transistor Count 7.2 Billion
Transistor Density 65.2 MTr/mm²	Transistor Density 22.93 MTr/mm²

Images