GPUs

AMD Radeon RX 7700 vs NVIDIA GeForce GTX 260 Full Specs

3,072 Shaders
2.4GHz
192 Shaders
576MHz
12GB GDDR6432GB/s
918MB GDDR3111.9GB/s
··
29.49 TFLOPS
··
476.9 GFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
200W
TDP
182W
Power Connectors
1x 8-Pin
-
Power Connectors
-
2x 6-Pin

Radeon RX 7700Radeon RX 7700118 TOPSINT4 Tensor
x247.34
GeForce GTX 260GeForce GTX 260476.9 GFLOPSFP32
x1

Clock Speed
···
Clock Speed
··
Peak OPS
118 TOPSINT4 Tensor
Peak OPS
476.9 GFLOPSFP32
Tensor FP16-16
29.49 TFLOPS
Tensor FP16-32
29.49 TFLOPS
-
BF16
58.98 TFLOPS
Tensor BF16
29.49 TFLOPS
-
FP32
29.49 TFLOPS
FP32
476.9 GFLOPS
FP64
921.6 GFLOPS
FP64
59.62 GFLOPS
Tensor INT4
118 TOPS
Tensor INT4
-
Tensor INT8
29.49 TOPS
-
Pixel Rate
230.4 GPixel/s
Pixel Rate
34.8 GPixel/s
Texture Rate
460.8 GTexel/s
Texture Rate
79.5 GTexel/s

Shaders
3,072 Shaders
Shaders
192 Shaders
TMUs
192 TMUs
TMUs
64 TMUs
ROPs
96 ROPs
ROPs
28 ROPs
Tensor Cores
96 T-Cores
Tensor Cores
-
RT Cores
48 RT-Cores
RT Cores
-
CUs
48 CUs
SMs
24 SMs

Base Clock
1.9GHz
Base Clock
-
Boost Clock
2.4GHz
Boost Clock
576MHz
Shader Clock
-
Shader Clock
1.24GHz

L2 Cache
4.1MB shared
L2 Cache
256KB shared
L3 Cache
48MB shared
L3 Cache
-
L3 Bandwidth
1.69TB/s
L3 Bandwidth
-

12GB GDDR6
918MB GDDR3
Memory Bus
192-bit
Memory Bus
448-bit
Memory Speed
18GT/s
Memory Speed
2GT/s
Memory Bandwidth
432GB/s
Memory Bandwidth
111.9GB/s

TDP
200W
TDP
182W

Multi-Monitor
3
Multi-Monitor
2
HDCP
HDCP 2.3
HDCP
-

3x DisplayPort 2.1
-
1x HDMI 2.1
-
-
2x DVI-I Dual-Link
-
1x S-Video

Encoder Model
VCN 4.0
-

Decoder Model
VCN 4.0
Decoder Model
VP2

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
2.5-Slots
PCIe
2-Slots
Height
111 mm (4.37")
Width
267 mm (10.51")
Depth
50 mm (1.97")
Height
111 mm (4.37")
Width
267 mm (10.51")
Depth
38 mm (1.5")
Cooling
Open-Air
2x Fans
Cooling
Blower
1x Fan
Power Connectors
1x 8-Pin
Power Connectors
2x 6-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2023 branding
Branding
GeForce 2006 branding
Codename
Wheat Nas
Codename
NVA0
Chip Variant
Navi 32
Chip Variant
GT200-100-A2
Market Segment
Desktop
Market Segment
Desktop
Release Date
Aug 25, 2023
Release Date
Jun 16, 2008

Foundry
TSMC
Foundry
TSMC
Other Foundries
TSMCMCD
Other Foundries
-
Fabrication Node
N5
N6MCD
Fabrication Node
65nm
-
Die Size
200mm²
113mm²MCD
Die Size
576mm²
-
Transistor Count
28.1 Billion
6.2 BillionMCD
Transistor Count
1.4 Billion
-
Transistor Density
140.5 MTr/mm²
54.67 MTr/mm²MCD
Transistor Density
2.43 MTr/mm²
-

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