GPUs

AMD Radeon RX 9060 XT vs Apple FirePro D700 Full Specs

2,048 Shaders
3.13GHz
2,048 Shaders
850MHz
8GB GDDR6320GB/s
6GB GDDR5263GB/s
··
25.64 TFLOPS
··
3.48 TFLOPS
Form Factor
PCIe Card
Form Factor
Mac Pro Card
TDP
150W
TDP
250W
Power Connectors
1x 8-Pin
Power Connectors
-

Radeon RX 9060 XTRadeon RX 9060 XT820.5 TOPSINT4 Tensor Sparse
x235.67
FirePro D700FirePro D7003.48 TFLOPSFP32
x1

Clock Speed
···
Clock Speed
··
Peak OPS
820.5 TOPSINT4 Tensor Sparse
Peak OPS
3.48 TFLOPSFP32
Tensor FP8-16
102.6 TFLOPS
FP8-16 Tensor Sparse
205.1 TFLOPS
Tensor FP8-32
102.6 TFLOPS
FP8-32 Tensor Sparse
205.1 TFLOPS
-
Tensor FP16-16
51.28 TFLOPS
FP16-16 Tensor Sparse
102.6 TFLOPS
Tensor FP16-32
51.28 TFLOPS
FP16-32 Tensor Sparse
102.6 TFLOPS
-
BF16
51.28 TFLOPS
Tensor BF16
51.28 TFLOPS
BF16 Tensor Sparse
102.6 TFLOPS
-
FP32
25.64 TFLOPS
FP32
3.48 TFLOPS
FP64
801.3 GFLOPS
FP64
870.4 GFLOPS
Tensor INT4
410.3 TOPS
Tensor INT4
-
Tensor INT8
205.1 TOPS
-
Pixel Rate
200.3 GPixel/s
Pixel Rate
27.2 GPixel/s
Texture Rate
400.6 GTexel/s
Texture Rate
108.8 GTexel/s

Shaders
2,048 Shaders
Shaders
2,048 Shaders
TMUs
128 TMUs
TMUs
128 TMUs
ROPs
64 ROPs
ROPs
32 ROPs
Tensor Cores
64 T-Cores
Tensor Cores
-
RT Cores
32 RT-Cores
RT Cores
-
CUs
32 CUs
CUs
32 CUs

Base Clock
2.53GHz
Base Clock
-
Boost Clock
3.13GHz
Boost Clock
850MHz

L2 Cache
4.1MB shared
L2 Cache
768KB shared
L3 Cache
32MB shared
L3 Cache
-
L3 Bandwidth
1.13TB/s
L3 Bandwidth
-

8GB GDDR6
6GB GDDR5
Memory Bus
128-bit
Memory Bus
384-bit
Memory Speed
20GT/s
Memory Speed
5.5GT/s
Memory Bandwidth
320GB/s
Memory Bandwidth
263GB/s
ECC
No
ECC
No

TDP
150W
TDP
250W

Multi-Monitor
3
Multi-Monitor
6
HDCP
HDCP 2.3
HDCP
-

3x DisplayPort 2.1
-
1x HDMI 2.1
-

Encoder Model
VCN 4.0
Encoder Model
VCE 1.0

Decoder Model
VCN 4.0
Decoder Model
UVD 3.2

Form Factor
PCIe Card
Form Factor
Mac Pro Card
PCIe
2-Slots
PCIe
-
Height
111 mm (4.37")
Width
204 mm (8.03")
Depth
40 mm (1.57")
-
Cooling
Open-Air
3x Fans
Cooling
Passive
-
Power Connectors
1x 8-Pin
Power Connectors
-

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2023 branding
Branding
FirePro 2014 branding
Codename
-
Codename
Tahiti
Chip Variant
Navi 44 XL
Chip Variant
Tahiti LE
Market Segment
Desktop
Market Segment
Workstation
Release Date
May 20, 2025
Release Date
Jan 18, 2014

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N4P
Fabrication Node
28nm
Die Size
153mm²
Die Size
352mm²
Transistor Count
29.7 Billion
Transistor Count
4.3 Billion
Transistor Density
194.1 MTr/mm²
Transistor Density
12.25 MTr/mm²

No images available
No images available

Desktops
-
Desktops