GPUs

Apple 32-Core M4 Max vs Intel Graphics 4C 1900MHz Full Specs

4,096 Shaders
1.58GHz
512 Shaders
1.9GHz
Shared Memory409.6GB/sLPDDR5X
Shared Memory119.5GB/s
·
··
12.93 TFLOPS
··
1.95 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

32-Core M4 Max32-Core M4 Max12.93 TFLOPSFP16
x3.32
Graphics 4C 1900MHzGraphics 4C 1900MHz3.89 TFLOPSFP16
x1

Clock Speed
··
Clock Speed
··
Peak OPS
12.93 TFLOPSFP16
Peak OPS
3.89 TFLOPSFP16
FP32
12.93 TFLOPS
FP32
1.95 TFLOPS
-
FP64
486.4 GFLOPS
Pixel Rate
202 GPixel/s
Pixel Rate
30.4 GPixel/s
Texture Rate
404 GTexel/s
Texture Rate
60.8 GTexel/s

Shaders
4,096 Shaders
Shaders
512 Shaders
TMUs
256 TMUs
TMUs
32 TMUs
ROPs
128 ROPs
ROPs
16 ROPs
RT Cores
32 RT-Cores
RT Cores
4 RT-Cores
EUs
512 EUs
EUs
64 EUs

Boost Clock
1.58GHz
Boost Clock
1.9GHz

L2 Cache
8.2MB shared
L2 Cache
4.1MB shared

Shared MemoryLPDDR5X
Shared Memory
·
Memory Bus
384-bit
Memory Bus
128-bit
Memory Speed
8.5GT/s
Memory Speed
7.5GT/s
Memory Bandwidth
409.6GB/s
Memory Bandwidth
119.5GB/s
ECC
No
ECC
No

Multi-Monitor
4
Multi-Monitor
4

Encoder Model
2x Apple Media Engine 3
Encoder Model
Arc

Decoder Model
2x Apple Media Engine 3
Decoder Model
Arc

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
M4 Max branding
Branding
Graphics 2024 branding
Codename
G16M
Codename
Xe LPG
Chip Variant
-
Chip Variant
GT1
Market Segment
Laptop
Market Segment
Laptop
Release Date
Oct 30, 2024
Release Date
Dec 14, 2023

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N3E
Fabrication Node
N5
Die Size
454mm²
Die Size
23mm²
Transistor Count
76 Billion
Transistor Count
-
Transistor Density
167 MTr/mm²
Transistor Density
-

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