GPUs

Apple 32-Core M4 Max vs NVIDIA GeForce RTX 4070 Laptop 115W Full Specs

4,096 Shaders
1.58GHz
4,608 Shaders
2.17GHz
Shared Memory409.6GB/sLPDDR5X
8GB GDDR6256GB/s
··
12.93 TFLOPS
··
20.04 TFLOPS
Form Factor
iGPU
Form Factor
Soldered
TDP
Shared
TDP
115W

32-Core M4 Max32-Core M4 Max12.93 TFLOPSFP16
x1
GeForce RTX 4070 Laptop 115WGeForce RTX 4070 Laptop 115W641.4 TOPSINT4 Tensor Sparse
x49.62

Clock Speed
··
Clock Speed
···
Peak OPS
12.93 TFLOPSFP16
Peak OPS
641.4 TOPSINT4 Tensor Sparse
-
Tensor FP8-16
160.4 TFLOPS
FP8-16 Tensor Sparse
320.7 TFLOPS
Tensor FP8-32
80.18 TFLOPS
FP8-32 Tensor Sparse
160.4 TFLOPS
-
Tensor FP16-16
80.18 TFLOPS
FP16-16 Tensor Sparse
160.4 TFLOPS
Tensor FP16-32
40.09 TFLOPS
FP16-32 Tensor Sparse
80.18 TFLOPS
-
BF16
20.04 TFLOPS
Tensor BF16
40.09 TFLOPS
BF16 Tensor Sparse
80.18 TFLOPS
Tensor TF32
-
Tensor TF32
20.04 TFLOPS
FP32
12.93 TFLOPS
FP32
20.04 TFLOPS
-
FP64
313.2 GFLOPS
Tensor INT4
-
Tensor INT4
320.7 TOPS
-
Tensor INT8
160.4 TOPS
Ray
-
Ray
46.33 TOPS
Pixel Rate
202 GPixel/s
Pixel Rate
104.4 GPixel/s
Texture Rate
404 GTexel/s
Texture Rate
313.2 GTexel/s

Shaders
4,096 Shaders
Shaders
4,608 Shaders
TMUs
256 TMUs
TMUs
144 TMUs
ROPs
128 ROPs
ROPs
48 ROPs
Tensor Cores
-
Tensor Cores
144 T-Cores
RT Cores
32 RT-Cores
RT Cores
36 RT-Cores
EUs
512 EUs
SMs
36 SMs

Base Clock
-
Base Clock
2.07GHz
Boost Clock
1.58GHz
Boost Clock
2.17GHz

L2 Cache
8.2MB shared
L2 Cache
32.8MB shared

Shared MemoryLPDDR5X
8GB GDDR6
Memory Bus
384-bit
Memory Bus
128-bit
Memory Speed
8.5GT/s
Memory Speed
16GT/s
Memory Bandwidth
409.6GB/s
Memory Bandwidth
256GB/s

TDP
Shared
TDP
115W

Multi-Monitor
4
Multi-Monitor
4
HDCP
-
HDCP
HDCP 2.3

Encoder Model
2x Apple Media Engine 3
Encoder Model
NVENC 8

Decoder Model
2x Apple Media Engine 3
Decoder Model
NVDEC 5

Form Factor
iGPU
Form Factor
Soldered

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
M4 Max branding
Branding
GeForce RTX 2022 branding
Codename
G16M
Codename
NV186
Chip Variant
-
Chip Variant
AD106-350-A1
Market Segment
Laptop
Market Segment
Laptop
Release Date
Oct 30, 2024
Release Date
Feb 22, 2023

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N3E
Fabrication Node
4N
Die Size
454mm²
Die Size
188mm²
Transistor Count
76 Billion
Transistor Count
22.9 Billion
Transistor Density
167 MTr/mm²
Transistor Density
121.8 MTr/mm²

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