Apple 32-Core M4 Max vs NVIDIA GeForce RTX 4070 Laptop 115W Full Specs
4,096 Shaders 1.58GHz | 4,608 Shaders 2.17GHz |
Shared Memory409.6GB/sLPDDR5X | 8GB GDDR6256GB/s placeholder |
·· 12.93 TFLOPS | ·· 20.04 TFLOPS |
Form Factor iGPU | Form Factor Soldered |
TDP Shared | TDP 115W |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 12.93 TFLOPSFP16 | Peak OPS 641.4 TOPSINT4 Tensor Sparse |
- | Tensor FP8-16 160.4 TFLOPSFP8-16 Tensor Sparse 320.7 TFLOPSTensor FP8-32 80.18 TFLOPSFP8-32 Tensor Sparse 160.4 TFLOPS |
- | Tensor FP16-16 80.18 TFLOPSFP16-16 Tensor Sparse 160.4 TFLOPSTensor FP16-32 40.09 TFLOPSFP16-32 Tensor Sparse 80.18 TFLOPS |
- | BF16 20.04 TFLOPSTensor BF16 40.09 TFLOPSBF16 Tensor Sparse 80.18 TFLOPS |
Tensor TF32 - | Tensor TF32 20.04 TFLOPS |
FP32 12.93 TFLOPS | FP32 20.04 TFLOPS |
- | FP64 313.2 GFLOPS |
Tensor INT4 - | Tensor INT4 320.7 TOPS |
- | Tensor INT8 160.4 TOPS |
Ray - | Ray 46.33 TOPS |
Pixel Rate 202 GPixel/s | Pixel Rate 104.4 GPixel/s |
Texture Rate 404 GTexel/s | Texture Rate 313.2 GTexel/s |
Shaders 4,096 Shaders | Shaders 4,608 Shaders |
TMUs 256 TMUs | TMUs 144 TMUs |
ROPs 128 ROPs | ROPs 48 ROPs |
Tensor Cores - | Tensor Cores 144 T-Cores |
RT Cores 32 RT-Cores | RT Cores 36 RT-Cores |
EUs 512 EUs | SMs 36 SMs |
Base Clock - | Base Clock 2.07GHz |
Boost Clock 1.58GHz | Boost Clock 2.17GHz |
L2 Cache 8.2MB shared | L2 Cache 32.8MB shared |
Shared MemoryLPDDR5X | 8GB GDDR6 placeholder |
Memory Bus 384-bit | Memory Bus 128-bit |
Memory Speed 8.5GT/s | Memory Speed 16GT/s |
Memory Bandwidth 409.6GB/s | Memory Bandwidth 256GB/s |
TDP Shared | TDP 115W |
Multi-Monitor 4 | Multi-Monitor 4 |
HDCP - | HDCP HDCP 2.3 |
Encoder Model 2x Apple Media Engine 3 | Encoder Model NVENC 8 |
Decoder Model 2x Apple Media Engine 3 | Decoder Model NVDEC 5 |
Form Factor iGPU | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename G16M | Codename NV186 |
Chip Variant - | Chip Variant AD106-350-A1 |
Market Segment Laptop | Market Segment Laptop |
Release Date Oct 30, 2024 | Release Date Feb 22, 2023 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N3E | Fabrication Node 4N |
Die Size 454mm² | Die Size 188mm² |
Transistor Count 76 Billion | Transistor Count 22.9 Billion |
Transistor Density 167 MTr/mm² | Transistor Density 121.8 MTr/mm² |
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