Apple 4-Core A16 vs ARM Mali-400 MP4 400MHz Full Specs
512 Shaders 1.34GHz | 16 Shaders 400MHz |
Shared Memory51.2GB/sLPDDR5 | Shared Memory6.4GB/s ··· |
·· 1.37 TFLOPS | ·· 12.8 GFLOPS |
Form Factor iGPU | Form Factor iGPU |
TDP Shared | TDP Shared |
Clock Speed ·· | Clock Speed ·· |
Peak OPS 1.37 TFLOPSFP16 | Peak OPS 12.8 GFLOPSFP32 |
FP32 1.37 TFLOPS | FP32 12.8 GFLOPS |
Pixel Rate 21.4 GPixel/s | Pixel Rate 1.6 GPixel/s |
Texture Rate 42.8 GTexel/s | Texture Rate 1.6 GTexel/s |
Shaders 512 Shaders | Shaders 16 Shaders |
TMUs 32 TMUs | TMUs 4 TMUs |
ROPs 16 ROPs | ROPs 4 ROPs |
EUs 64 EUs | EUs 4 EUs |
Boost Clock 1.34GHz | Boost Clock 400MHz |
L2 Cache 512KB shared | L2 Cache - |
Shared MemoryLPDDR5 | Shared Memory ··· |
Memory Bus 64-bit | Memory Bus 64-bit |
Memory Speed 6.4GT/s | Memory Speed 1.6GT/s |
Memory Bandwidth 51.2GB/s | Memory Bandwidth 6.4GB/s |
Multi-Monitor 1 | Multi-Monitor - |
Form Factor iGPU | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename G15P | Codename - |
Market Segment Smartphone | Market Segment Smartphone |
Release Date Mar 4, 2025 | Release Date Jan 1, 2014 |
Foundry TSMC | Foundry Samsung |
Fabrication Node N4P | Fabrication Node 45nm |
Die Size 115mm² | Die Size - |
Transistor Count 16 Billion | Transistor Count - |
Transistor Density 139 MTr/mm² | Transistor Density - |
No images available
No images available
CPUs | CPUs |
Tablets | Tablets - |



